Temporary 0-Level MEMS Packaging Using a Heat Decomposable Sealing Ring

Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Hoof, R. Van; Severi, S.; Coster, J. De; Beernaert, Roel; Rudra, S.; Soussan, Philippe; Witvrouw, Ann

doi:10.1016/j.proeng.2011.12.370

Cited by 2 publications

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…If the MEMS device cannot be tested on a wafer, and a permanent package is not required, temporary wafer level packaging is an interesting alternative. Several temporary packaging methods have been proposed in literature, including thermo-compressive packaging [23], the use of glass caps laminated with UV-sensitive tape [24], or a heat-decomposable bonding ring [25]. These temporary packaging processes involve some challenges, such as the alignment of the capping to the MEMS devices, the debris-free stripping process to decap the package from the devices after the dicing step, etc.…”

Section: Introductionmentioning

confidence: 99%

A Parylene temporary packaging technique for MEMS wafer handling

Wen

Wouters

Ceyssens

et al. 2012

Sensors and Actuators A: Physical

Self Cite

View full text Add to dashboard Cite

This paper presents a wafer-level temporary packaging technique utilizing a chemical vapor deposited (CVD) poly-(p-xylylene) polymer Parylene film, and oxygen plasma etching. As a test case, released, unpackaged accelerometers fabricated in a SiGe MEMS above IC technology were coated with two different types of Parylene, Parylene N and Parylene C respectively, as dicing protection. Oxygen plasma is used to etch the Parylene and to release the freestanding structures after dicing. The final releasing results are compared, and Parylene N turns out to be the best material for temporary packaging. The devices are electrostatically characterized after the Parylene coating. The results demonstrate the feasibility of using Parylene as a temporary protective material for both metal and semiconductor MEMS devices, to prevent any damage during subsequent wafer handling and dicing.

show abstract

Section: Introductionmentioning

confidence: 99%