Temperature resistant amorphous polyimides with high intrinsic permittivity for electronic applications

Perfluorocyclobutyl-containing transparent polyimides with low dielectric constant and low dielectric loss

“…This polarity difference was also observed in the DFT calculations, with PFODA-cis showing a higher dipole moment (3.11 Debye) than PFODAtrans (1.24 Debye). These two isomers were separated and confirmed by 1 H, 13 C, and 19 F nuclear magnetic resonance (NMR) (Fig. S2-S5 †) and mass spectroscopy (Fig.…”

“…11 Among the diverse highperformance polymer materials, polyimides are known as a "problem solver" because of their excellent integrative properties including excellent flexibility, thermal stability, solvent resistance and mechanical strength. [12][13][14][15] Nonetheless, the polar imide group endows the polyimide with a relatively high dielectric constant (around 3.5), which does not meet the requirements of the microelectronics industry. 16 From the perspective of molecular structure design, there are two main strategies to lower the dielectric constant in polyimides: one is introducing large pendant groups to decrease the packing density of the polyimide chains; 5,[17][18][19] the other is increasing the amount of fluorine atoms on the polyimide backbone to reduce the polarization ability.…”

Polymer-based dielectrics with high permittivity and low dielectric loss for flexible electronics

“…[63][64][65] In particular, a polar backbone in polyimides has attracted many researchers to use them as high-k dielectrics. 36,[66][67][68][69][70][71][72] Generally, as shown in Fig. 5a, a two-step approach is used to fabricate the PI.…”

Polyimide Films Containing Trifluoromethoxy Groups with High Comprehensive Performance for Flexible Circuitry Substrates

“…Therefore, it is still a great challenge to balance the optical characteristics, mechanical properties, and thermal stabilities to obtain desirable colorless and transparent PI flexible substrates. More recently, some investigations have been carried out to develop colorless and transparent PI optical films along with high thermal stability and excellent mechanical properties, such as multicomponent copolymerization and silver nanowire doping modification, which are expected to support the prospective flexible substrates of electronic or micro-optical devices in the fields of displays, memory, lighting, solar cells, sensors, and waveguides. − …”