Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness

Hot deformation behavior of the Cu-2Ni-0.5Si-0.15Ag alloy was investigated by hot compression tests using the Gleeble-1500D thermo-simulator in the 873 K to 1073 K (600°C to 800°C) temperatures range with the 0.01 to 5 s À1 strain rate. The flow stress strongly depends on the deformation parameters, including temperature and strain rate. The flow stress decreases with the deformation temperature and increases with the strain rate. The constitutive relationship between the peak stress, the strain rate, and the deformation temperature can be described by the Zener-Hollomon Z parameter in the hyperbolic sine function with the hot deformation activation energy of 316 kJ/mol. The dynamic recrystallization (DRX) is one of the important softening mechanisms of the Cu-2Ni-0.5Si-0.15Ag alloy during hot deformation. The DRX behavior of the Cu-2Ni-0.5Si-0.15Ag alloy is strongly affected by the Z parameter. Lower Z parameter leads to more adequate DRX proceeding.

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“…The power law in Eq. [1] breaks down at high stress levels, whereas the exponential law in Eq. [2] breaks down at the low stress levels.…”

Section: B Constitutive Analysismentioning

confidence: 99%

“…Thus, the lead frame is very important for the microelectronics industry. [1] The lead frame material should be adequate heat and electrical conductor, have high strength and heat resistance, along with excellent processing properties. Many experts have conducted a lot of research to obtain the desired material for the lead frame.…”

Section: Introductionmentioning

confidence: 99%

Deformation Behavior and Microstructure Evolution of the Cu-2Ni-0.5Si-0.15Ag Alloy During Hot Compression

Zhang

Chai

et al. 2015

Metall Mater Trans A

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“…In the experiments the elastic properties of the two Si substrates are dominant and the elastic properties of the thin films between can be disregarded. Another possibility to calculate the interface energy release rate for a bi-layered material system consisting of two different materials is given in Tran et al [28].…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass

et al. 2015

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“…Copper alloys are widely used in electronics due to high strength and good electrical conductivity (Ref [1][2][3][4][5]. The lead frame is important for microelectronics, since it is a foundation of the integrated circuit, supporting the chip, transmitting electric signals, and radiating generated heat.…”

Section: Introductionmentioning

confidence: 99%

Effects of Ce Addition on High Temperature Deformation Behavior of Cu-Cr-Zr Alloys

Zhang

Tran

Chai

et al. 2015

J. of Materi Eng and Perform

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Hot deformation behavior of the Cu-Cr-Zr and Cu-Cr-Zr-Ce alloys was investigated by compressive tests using the Glee-ble-1500D thermomechanical simulator at 650-850°C and 0.001-10 s 21 strain rate. The flow stress decreased with the deformation temperature at a given stain rate. However, the flow stress increased with the strain rate at the same deformation temperature. The constitutive equations for two kinds of alloys were obtained by correlating the flow stress, the strain rate and temperature using stepwise regression analysis. The addition of Ce can refine the grain and effectively accelerate dynamic recrystallization. The processing maps were established, based on the dynamic material model. Instability zones in the flow behavior can be easily recognized. Hot deformation optimal processing parameters were obtained in the range of this experiment. The hot deformation characteristics and microstructure were also analyzed by the processing maps. The addition of Ce can optimize hot workability of the Cu-Cr-Zr alloy.

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Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness

Cited by 43 publications

References 14 publications

Deformation Behavior and Microstructure Evolution of the Cu-2Ni-0.5Si-0.15Ag Alloy During Hot Compression

Deformation Behavior and Microstructure Evolution of the Cu-2Ni-0.5Si-0.15Ag Alloy During Hot Compression

Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass

Effects of Ce Addition on High Temperature Deformation Behavior of Cu-Cr-Zr Alloys

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