2016
DOI: 10.3788/cjl201643.0403003
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Temperature Field During Selective Laser Melting of Metal Powder Under Different Scanning Strategies

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Cited by 6 publications
(3 citation statements)
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“…Meanwhile, the partition scanning strategy has a pre-heating effect on adjacent zones, thereby dropping the thermal gradient. Hence, the temperature field of the adjoining scanning zone became uniform, and the corresponding residual stress was also reduced [18,21,22,44]. In this work, the grid size of the sample fabricated using the chessboard partition scanning strategy was the smallest and obtained the lowest thermal gradient and uniform temperature field.…”
Section: Discussionmentioning
confidence: 75%
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“…Meanwhile, the partition scanning strategy has a pre-heating effect on adjacent zones, thereby dropping the thermal gradient. Hence, the temperature field of the adjoining scanning zone became uniform, and the corresponding residual stress was also reduced [18,21,22,44]. In this work, the grid size of the sample fabricated using the chessboard partition scanning strategy was the smallest and obtained the lowest thermal gradient and uniform temperature field.…”
Section: Discussionmentioning
confidence: 75%
“…However, the significant temperature gradient, fast cooling rate, and repeated re-melting processing, during SLM, lead to excessive-high residual stress in the as-fabricated parts, resulting in warpage and cracks [17,18]. The warpage and cracks degrade the mechanical properties of SLM parts [19][20][21][22], and bring challenges to the SLM fabrication of high-quality components.…”
Section: Introductionmentioning
confidence: 99%
“…For multichannel and multilayer thinwalled parts, the optimization of the scanning strategy is the key method to control the residual stress and deformation (Ding, 2018;Xv, 2016). Chen et al established a three-dimensional transient finite element model to analyze the influence of island scanning strategy and serpentine scanning strategy on the overall temperature field of the horizontal thin-walled plate, and further pointed out that the finite element model can not only capture temperature field changes but also provide a feasible idea for precise control of metallographic directional growth (Chen et al, 2016). Li et al studied the changes of temperature field, stress field and strain field under different scanning lengths based on thermal-structural coupling simulation and carried out corresponding experiments (Li et al, 2018).…”
Section: Introductionmentioning
confidence: 99%