Temperature effect on physical properties and surface morphology of printed silver ink during continuous laser scanning sintering

Lee, Iksang; Ryu, Kyongtae; Park, Kyung-Hoon; Moon, Yoon-Jae; Hwang, Jeongjae; Moon, Seung-Jae

doi:10.1016/j.ijheatmasstransfer.2016.11.095

Cited by 22 publications

(11 citation statements)

References 17 publications

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“…The thermal conductivity of Cu nanoparticles is generally considered as a temperature dependent variable. In previous studies, an exponential equation has been used as an effective approximation to estimate the thermal conductivity of metal nanoparticles at different temperatures, which basically agrees with the experimental results [23]. In this study, the as-synthesized Cu nanoparticles were sintered in a mold…”

Section: Methodssupporting

confidence: 81%

Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates

Yang

et al. 2021

J. Phys. D: Appl. Phys.

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In this paper, a facile method was introduced to fabricate fine conductive patterns by low-temperature selective laser sintering of Cu nanoparticles. By virtue of a nanosecond-pulsed ultraviolet laser source, fine circuits with a thickness of ∼8 µm and a conductivity of 3-6.5 × 10 6 S m −1 was successfully fabricated from Cu nanoparticle paste with a high metal content >80 wt.% on a flexible substrate at a wide scan rate range of 5-500 mm s −1 . The sintered circuits exhibited a special sandwich morphology, with fully melted features in the centre and thermally sintered neck-connected features on the edges. A twofold linear relationship between the width of thermally sintered region and the reciprocal of the laser scan rate was revealed, indicating a heat dissipation mode transition from metal layer dominated dissipation to substrate dominated dissipation with the decrease of the laser scan rate. Finite element simulations were carried out to study the evolutions of temperature field and heat dissipation with changing laser scan rate and power, and the results fitted well with experimental results. On this basis, a relational expression was further proposed to determine the optimal processing window for laser sintering of metal nanoparticle layers. Our method extends the producible thickness and improves the fabrication efficiency of laser-printed circuits with desirable conductivity. The findings of this study can provide a guidance for understanding and controlling the sintering and heat transfer process of printing methods with similar materials and techniques.

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Section: Methodssupporting

confidence: 81%

Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates

Yang

et al. 2021

J. Phys. D: Appl. Phys.

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“…In addition to decreasing the size of the particles, a better sintering method is also important. To date, several methods have been put forward including thermal sintering, 25 plasma sintering, 24,26,27 photonic sintering, 28,29 laser sintering, [30][31][32] microwave sintering, 33 and chemical sintering. [34][35][36] Among these, chemical sintering is a promising method because it does not need external energy and can be realized at room temperature.…”

Section: Introductionmentioning

confidence: 99%

Large-scale and facile synthesis of silver nanoparticles via a microwave method for a conductive pen

et al. 2017

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“…For instance, the temperature gradients during PDMS curing should be minimized as the PDMS curing temperature determines the PDMS mechanical properties, , shrinkage, and flatness . As another example, the temperature during sintering of silver nanoparticles influences their size, resistivity, , and reflectivity. , Similarly, different curing methods, even with an identical nominal temperature, may result in different physical, mechanical, and tribological properties of PDMS . Nevertheless, obviously, no method for keeping devices at the desired temperature can guarantee perfect temperature uniformity.…”

Section: Resultsmentioning

confidence: 99%

Thin PDMS-on-Sacrificial-PCB Devices

Pezzilli

Prestopino

Montoya

et al. 2022

ACS Appl. Electron. Mater.

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Poly(dimethylsiloxane) (PDMS) devices must often be so thin (e.g., <100 μm) and, therefore, so fragile that their mechanical release becomes challenging. As a simple solution, PDMS devices are frequently released by dissolving an underlying sacrificial resist. However, there may be several other issues, including temperature gradients during fabrication, electrical characterization, handling, co-integration with electronics, fabrication time, and cost. Here, we show that conventional printed circuit boards (PCBs) can be ideal sacrificial carriers, which can also perform useful functions during fabrication. The thick (e.g., 35 μm) and thermally conductive PCB copper layer behaves as an excellent heat spreading plate during temperature-sensitive process steps (e.g., PDMS curing and sintering of conductive inks) and enables pre-release electrical stimulations and characterizations of PDMS, which may help during process development. Experiments and finite element method (FEM) simulations confirm that the PCB copper layer can improve temperature uniformity. The UV-protecting film attached to the PCB can be cut to constitute a frame for easy handling. The PCB photoresist enables the straightforward release of PDMS by acetone, which is among the most environmentally friendly chemicals. Contacts can be opened by a simple bump-cut-peel strategy. As proofs of concept, we demonstrate pre-release capacitive characterization of PDMS for evaluating the ability to fabricate thin, but uniform and robust devices and post-release resistive characterization of stretchable strain sensor or interconnects encapsulated in PDMS. The proposed approach is simple, cheap, and environmentally friendly, can improve temperature uniformity throughout the pre-release process steps, enables pre-release electrical characterizations, can simplify co-integration with electronics and can be generalized to other elastomers.

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Temperature effect on physical properties and surface morphology of printed silver ink during continuous laser scanning sintering

Cited by 22 publications

References 17 publications

Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates

Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates

Large-scale and facile synthesis of silver nanoparticles via a microwave method for a conductive pen

Thin PDMS-on-Sacrificial-PCB Devices

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