Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples

Wimmer, Alexander; Smolka, Martin; Heinz, Walther; Detzel, Thomas; Robl, W.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R.; Dehm, Gerhard

doi:10.1016/j.msea.2014.09.029

Cited by 38 publications

(20 citation statements)

References 58 publications

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“…SEM images of sample type B taken at 293 K, 473 K and 673 K clearly showed ductile behaviour with intragranular fracture accompanied by the formation of glide steps at all temperatures. In contrast, sample type A showed strong plastic deformation with several grains involved at 293 K, whereas at higher temperatures cracking occurred preferentially along the grain boundaries indicative of grain boundary embrittlement [29].…”

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 87%

“…Indeed, for electrodeposited Cu thin films it has been demonstrated that additives can cause a reduction of the grain size. However, as revealed by electron backscatter diffraction in a scanning electron microscopy (EBSD/SEM), these additives also cause embrittlement of the microstructures at elevated temperatures [29]. In the present section we describe how ab initio calculations as based on density functional theory can be employed to obtain a deeper understanding of the origin of this failure [29].…”

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 99%

“…In the experiments reported in Ref. [29] Cu thin films were synthesized by electrodeposition using two different additive systems in the electrolyte intended to modify the grain size (sample type A and B). EBSD/SEM images of these films are displayed in Figure 5.…”

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 99%

“…An indication of the origin of the different behaviour of the two sample types was obtained from chemical analysis, specifically from time-of-flight secondary ion mass spectroscopy (TOF-SIMS), which showed a significantly higher content of both S and Cl in sample type A. In addition, the experiments indicated considerable enrichment of these impurities at the grain boundaries [29].…”

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 99%

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Unravelling the Potential of Density Functional Theory through Integrated Computational Environments: Recent Applications of the Vienna Ab Initio Simulation Package in the MedeA® Software

et al. 2018

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The development of density functional theory and the tremendous increase of compute power in recent decades have created a framework for the incredible success of modern computational materials engineering (CME). CME has been widely adopted in the academic world and is now established as a standard tool for industrial applications. As theory and compute resources have developed, highly efficient computer codes to solve the basic equations have been implemented and successively integrated into comprehensive computational environments leading to unprecedented increases in productivity. The MedeA software of Materials Design combines a set of comprehensive productivity tools with leading computer codes such as the Vienna Ab initio Simulation Package (VASP), LAMMPS, GIBBS and the UNiversal CLuster Expansion code (UNCLE), provides interoperability at different length and time scales. In the present review, technological applications including microelectronic materials, Li-ion batteries, disordered systems, high-throughput applications and transition-metal oxides for electronics applications are described in the context of the development of CME and with reference to the MedeA environment.

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Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 87%

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 99%

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 99%

Section: Embrittlement Of Cu Micro-structuresmentioning

confidence: 99%

See 2 more Smart Citations

Unravelling the Potential of Density Functional Theory through Integrated Computational Environments: Recent Applications of the Vienna Ab Initio Simulation Package in the MedeA® Software

et al. 2018

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“…However, this is in stark contrast to the results of Smolka et al [71] and Wimmer et al [72–74], who both tested polycrystalline micro-samples and observed a much stronger drop in yield strength for some microstructures. However, the results of Wimmer [74] suggested a brittle failure at the grain-boundaries due to segregation of impurities, mostly of sulphur. This indicates that the role of grain boundaries may dominate the temperature dependence of the mechanical behaviour for polycrystalline samples.…”

Section: Discussionmentioning

confidence: 99%

The effect of size on the strength of FCC metals at elevated temperatures: annealed copper

Wheeler

Kirchlechner

Micha

et al. 2016

Philosophical Magazine

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As the length scale of sample dimensions is reduced to the micron and sub-micron scales, the strength of various materials has been observed to increase with decreasing size, a fact commonly referred to as the ‘sample size effect’. In this work, the influence of temperature on the sample size effect in copper is investigated using in situ microcompression testing at 25, 200 and 400 °C in the SEM on vacuum-annealed copper structures, and the resulting deformed structures were analysed using X-ray μLaue diffraction and scanning electron microscopy. For pillars with sizes between 0.4 and 4 μm, the size effect was measured to be constant with temperature, within the measurement precision, up to half of the melting point of copper. It is expected that the size effect will remain constant with temperature until diffusion-controlled dislocation motion becomes significant at higher temperatures and/or lower strain rates. Furthermore, the annealing treatment of the copper micropillars produced structures which yielded at stresses three times greater than their un-annealed, FIB-machined counterparts.

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Atomic structure and segregation phenomena at copper grain boundaries

Meiners

Liebscher

Dehm

2016

European Microscopy Congress 2016: Proceedings

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The segregation of impurity atoms to grain boundaries can have significant influence on the cohesive properties, atomic arrangements and the mechanical properties of such interfaces. Therefore, it strongly impacts the macroscopic behavior of materials and understanding the atomic structure and related segregation behavior at grain boundaries is crucial to tailor materials with optimized physical properties [1] . Copper (Cu) is an attractive material for electronic applications, because of its good electrical and thermal conductivity. The effect of Sulphur on grain boundaries in Cu is of particular interest since it is improving the electromigration resistance but can also lead to grain boundary embrittlement [2] . In this study the atomic structure and chemistry of grain boundaries in polycrystalline Cu with variable Sulphur content (7 – 4000 ppm) are analyzed. In order to determine the distribution, size and orientation of the grains, Electron Backscatter Diffraction (EBSD) measurements were performed, as shown in Figure 1. The measurement reveals a grain size of 1‐4 mm and an orientation of the grain normal close to the [001] direction. Transmission electron microscopy (TEM) specimens are prepared conventionally by grinding, electro polishing and Ar + ion beam milling at specific regions from the EBSD scan in order to select special grain boundaries. This is shown exemplarily by the black circle in Figure 1. TEM methods (bright‐field imaging, selected area diffraction and high resolution TEM) are used to investigate the structure of selected grain boundaries. A preliminary example represented in Figure 2 reveals a high angle grain boundary. The specimen is tilted so that the upper grain is oriented in [001] zone axis while the resulting orientation of the lower grain is close to the [013] zone axis. The tilt component between both grains was determined to by measuring the misorientation between the (200) reflexes of both grains which is in good agreement with the EBSD measurement. The twist component of this random grain boundary is not yet fully determined and is part of current investigations. The atomic structure and segregation of Sulphur are characterized by aberration‐corrected scanning transmission electron microscopy (STEM) in combination with analytical techniques including energy‐dispersive X‐ray spectroscopy (EDX) and electron energy loss spectroscopy (EELS). Hence, information on the atomic arrangement of impurity atoms (interstitial and substitutional), the respective bonding and possible grain boundary precipitates will be obtained with sub‐nanometer resolution.

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Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples

Cited by 38 publications

References 58 publications

Unravelling the Potential of Density Functional Theory through Integrated Computational Environments: Recent Applications of the Vienna Ab Initio Simulation Package in the MedeA® Software

Unravelling the Potential of Density Functional Theory through Integrated Computational Environments: Recent Applications of the Vienna Ab Initio Simulation Package in the MedeA® Software

The effect of size on the strength of FCC metals at elevated temperatures: annealed copper

Atomic structure and segregation phenomena at copper grain boundaries

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