Temperature dependency in performance of solid state lighting drivers

Tarashioon, S.; Koh, Sau; Driel, W.D. van; Zhang, G.Q.

doi:10.1109/esime.2011.5765865

Cited by 9 publications

(4 citation statements)

References 3 publications

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“…In vehicles, the constant current (CC) is the best operating current for the LED array module [59] to produce consistent lighting when the voltage fluctuation occurs. There are two types of power source to realize the CC output at given input voltages and deliver an output voltage equal to the sum of the maximum Table 5 Optical design methods of the LED headlamp.…”

Section: Driver Electronicsmentioning

confidence: 99%

A review on light-emitting diode based automotive headlamps

Long

Zhou

et al. 2015

Renewable and Sustainable Energy Reviews

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Section: Driver Electronicsmentioning

confidence: 99%

A review on light-emitting diode based automotive headlamps

Long

Zhou

et al. 2015

Renewable and Sustainable Energy Reviews

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“…Also the quality of the light deteriorates under increasing temperatures, since LEDs tend to shift wavelength at higher temperatures, resulting in off-color light output (Hong and Narendran 2004). On a longer time horizon, due to high temperatures and high electrical currents, driver and lenses tend to degrade resulting in lumen depreciation and color shift (Tarashioon et al 2011;Narendran and Gu 2005;Koh et al 2011). The LED SiP can also fail catastrophically, when one of the components in the LED SiP instantly fails.…”

Section: Led System-in-packagementioning

confidence: 99%

Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language

Borst

Etman

Gielen³

et al. 2016

Struct Multidisc Optim

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LED System-in-Package (SiP) aims to reduce manufacturing and material costs of LED lighting products through integration of components into one single package, based on semiconductor technology. This introduces multidisciplinary coupling in the system behavior which requires reconsideration of the existing LED design decomposition practice. This paper presents our method to do a decomposition analysis of the multidisciplinary coupling structure for an industry scale LED SiP design problem. The innovative aspect of our method is the use of a specification language to specify the input-output (binary) relationships between design variables, behavioral responses, objective and constraint responses. A design structure matrix, representing the mutual linkage, is automatically generated from the specification. The rows and columns of the DSM are subsequently re-ordered using partitioning and sequencing algorithms to provide insight in the coupling structure. The method is illustrated by means of a simplified example. This paper is a revised and extended version of proceedings paper "Decomposition-based analysis of the multi-physical coupling structure in LED System-in-Package design" presented by the authors at the 10th World Congress on Structural and Multidisciplinary Optimization, May 19-24, 2013 Subsequently, the results for a recently manufactured LED SiP design prototype are presented.

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“…While the reliability of LEDs, especially on their performance with respect to thermal management has been reported quite frequently, very little attention is given on the driver reliability despite the fact that the LED driver is one of the weakest components in the LED system [1]. The reported accelerated test results for LED drivers are mainly focussed on the electrolytic capacitor at the output stage [2,3], however, the electrolytic capacitor has been avoided with driver design such as the linear-mode LED driver where no switching process is involved and thus no current ripple. Unfortunately, there is no detailed study on the reliability of the linear-mode-driver due probably to the lack of the information on the driver circuit design which is confidential.…”

Section: Introductionmentioning

confidence: 98%