We investigated the high-temperature characteristics for Al x Ga 1Àx N-based (x ¼ 0 { 0:57) vertical conducting diodes. In the forward current-voltage (I-V) characteristics, the offset voltage decreases with temperature because of the reduction of the built-in potential due to the decrease in the bandgap energy with temperature. In spite of an increase in SiC substrate resistance with temperature because of a decrease in the electron mobility, the on-state resistance of the diode with Al 0:22 Ga 0:78 N is as low as 1.45 m cm 2 even at 250 C because of the reduced resistance of the p-InGaN layer due to an increase in the hole concentration. In the reverse I-V characteristics, the breakdown voltage increases with increasing Al composition, x, of Al x Ga 1Àx N layer because the higher the Al composition of the Al x Ga 1Àx N layer is, the higher the critical electric field becomes. Although the reverse leakage current of Al x Ga 1Àx N-based diodes increases with increasing temperature, the breakdown voltage at elevated temperatures is similar to that at room temperature. These features indicate the feasibility of Al x Ga 1Àx N-based diodes for high-temperature operation.