Temperature and stress distribution in ultrasonic metal welding—An FEA-based study

Elangovan, S.; Semeer, S.; Prakasan, K.

doi:10.1016/j.jmatprotec.2008.03.032

Cited by 171 publications

(78 citation statements)

References 3 publications

(3 reference statements)

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“…The documentation of the stress vs. strain curves of silver indium solid solution phase would be valuable for further research and investigation for this material. For example, mechanical finite element analysis (FEA) [21,22] regarding to silver indium solid solution phase can be readily performed with the availability of this material mechanical properties such as yield stress, UTS, and stress vs. strain curves. Further work may be continued to study the other interesting properties of silver solid solution phase with indium.…”

Section: Resultsmentioning

confidence: 99%

The growth and stress vs. strain characterization of the silver solid solution phase with indium

Huo

Lee

2016

Journal of Alloys and Compounds

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The growth and stress vs. strain characterization of the silver solid solution phase with indium Silver solid solution phase with indium has been discovered to have great mechanical properties and anti-tarnishing property, as shown in the results of our previous study. It is important to know the stress vs. strain curve before adopting this material in industrial applications. The growth of the homogeneous silver solid solution phase with indium is first described. The X-ray diffraction (XRD) patterns and scanning electron microscope/energy dispersive X-ray spectroscopy (SEM/EDX) results are reported to verify the chemical composition of silver solid solution phase with indium samples. Based on the results, one could reversely determine the indium element composition in (Ag)exxIn solid solution by examining the lattice constant value using XRD for unknown compositions. The preparation of ASTM tensile test samples and tensile test experimental setting are explained in details. The intrinsic mechanical material properties of silver solid solution phase with indium, i.e., characteristic stress vs. strain curves, are presented and analyzed, with pure silver stress vs. strain curve in comparison. According to the experimental results, silver solid solution phase with indium exhibits low yield strength, high ultimate tensile strength, and large elongation value before fracture, compared to pure silver. In addition, fractography of the fracture surface of the tested sample has been studied to confirm the superior ductility of silver solid solution phase with indium. These superior mechanical properties may bring silver solid solution phase with indium new applications in various industries such as electronics and brazing.

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Section: Resultsmentioning

confidence: 99%

The growth and stress vs. strain characterization of the silver solid solution phase with indium

Huo

Lee

2016

Journal of Alloys and Compounds

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“…Comparison of the temperature profile developed using adaptive and uniform contact conductance with experimental results showed the possibility of accurate determination using the present model. Elangovan et al [10] conducted finite element based study in ultrasonic spot welding to predict the interface temperature and stress distribution during welding and their influences in the work piece, sonotrode and anvil. This study also focused to find out the effect of clamping forces, material thickness and coefficient of friction during heat generation at the weld interface.…”

Section: Introductionmentioning

confidence: 99%

Experimental and theoretical investigations on temperature distribution at the joint interface for copper joints using ultrasonic welding

Elangovan

2014

Manufacturing Rev.

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-Ultrasonic welding is a solid-state joining process that produces joints by the application of high frequency vibratory energy in the work pieces held together under pressure without melting. Copper and its alloys are extensively used in electrical and electronic industry because of its excellent electrical and thermal properties. This paper mainly focused on temperature distribution and the influence of process parameters at the joint interface while joining copper sheets using ultrasonic welding process. Experiments are carried out using Cu sheets (0.2 mm and 0.3 mm thickness) and the interface temperature is measured using Data Acquisition (DAQ) System (thermocouple) and thermal imager. Numerical and finite element based model for temperature distribution at the interface are developed and solved the same using Finite Difference Method (FDM) and Finite Element Analysis (FEA). The results obtained from FDM and FEA model shows similar trend with experimental results and are found to be in good agreement.

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“…During ultrasonic welding, heat generation mainly occurs at the interface between the two sheets from both mechanical deformation and friction [14]. Thus, a constant surface heat flux was applied in this model at the interface between the top and bottom copper sheets.…”

Section: Process Modelingmentioning

confidence: 99%

“…Elangovan et al [14] developed a two-dimensional (2D) finite element (FE) model for ultrasonic welding of dissimilar materials. In their model, the effective heat generation terms were adopted from a previous study [15] for modeling heat generation due to deformation and friction under ultrasonic vibration.…”

Section: Introductionmentioning

confidence: 99%

Simulating microstructure evolution of battery tabs during ultrasonic welding

Shen

Samanta

Ding

et al. 2016

Journal of Manufacturing Processes

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a b s t r a c tUltrasonic welding offers ability to weld thin layers of malleable metals at low temperature and low power consumption. During ultrasonic welding, intensive material interactions occur due to the severe plastic deformation (SPD) and frictional heat generation, which leads to the microstructural change. Different grain microstructures have been observed after different ultrasonic welding conditions. Theory of the microstructural evolution was for the first time hypothesized as three regimes, namely SPD, dynamic recrystallization (DRX) and grain growth according to the material thermomechanical loading conditions. A novel metallo-thermo-mechanically coupled model was developed to model the temperature-dependent mechanical deformation and microstructural evolution during the ultrasonic spot welding process. The numerical analysis was carried out with a three-dimensional (3D) finite element model using DEFORM 11.0. The material constitutive model considered cyclic plasticity, thermal softening and acoustic softening. Dynamic recrystallization and grain growth kinetics laws were applied to simulate the microstructural evolution under different welding time durations. The simulation results demonstrated that the essential characteristics of the deformation field and microstructure evolution during ultrasonic welding were well captured by the metallo-thermo-mechanically coupled model. The numerical framework developed in this study has been shown to be a powerful tool to optimize the ultrasonic welding process for its mechanical properties and microstructures.

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Temperature and stress distribution in ultrasonic metal welding—An FEA-based study

Cited by 171 publications

References 3 publications

The growth and stress vs. strain characterization of the silver solid solution phase with indium

The growth and stress vs. strain characterization of the silver solid solution phase with indium

Experimental and theoretical investigations on temperature distribution at the joint interface for copper joints using ultrasonic welding

Simulating microstructure evolution of battery tabs during ultrasonic welding

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