Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves

Lin, Ying; Zhang, Yunxiao; Wang, Kun; Wu, Kangning; Li, Helong; Wang, Jianing; Li, Kejie; Ding, Lijian

doi:10.1109/jestpe.2022.3195177

Cited by 18 publications

(7 citation statements)

References 37 publications

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“…These changes are due to the increase in charge carriers by high-temperature performance. Y. Lin et al [73] suggested that the ceramic substrate remains stable during insulation degradation, and attention must be given to the electrical parameters of the SG encapsulant. In their temperature and degradation-dependent electric field analysis, it was discovered that the electric field stress at TP increases by 100% when the temperature rises from 150 to 250°C while simultaneously decreasing the PDIV by 24%.…”

Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

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Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap (UWBG) materials. These materials, like silicon carbide (SiC), aluminum nitride (AlN), and diamond, offer advantages with higher power density, decreased weight, and expanded operational abilities regarding temperature, voltage, and frequency. However, the pursuit of pushing these limits confronts challenges within insulation systems, which may struggle to endure the demands of these parameters, potentially resulting in unfavorable conditions like high electric field, space charge accumulation, electrical treeing, and partial discharge (PD), leading to insulation failure. The emphasis of this paper is to review the insulation challenges within (U)WBG power modules and recent research in mitigating the electric field stress at triple points (TPs) and resolving the PD issues. The manuscript first discusses the high electric field stress issue at triple points. Then, ceramic substrate materials, encapsulation materials, and the influence of harsh weather conditions on them are reviewed. The space charge, electrical treeing, and PD issues within encapsulation materials are analyzed under practical operation conditions of (U)WBG power modules like high frequency, temperature, and square wave pulses. Finally, the various strategies to alleviate the associated insulation challenges are meticulously discussed. While the identified mitigation strategies are able to strengthen insulation systems for packaging, their validation under actual operational conditions of (U)WBG power modules remains relatively unexplored, representing a potential avenue for further investigation. This review offers a valuable framework by providing the constraints of the current studies and recommendations for the future that can be utilized as a reference point for future research endeavors. Index Terms-(U)WBG power module packaging, partial discharge, triple points, encapsulation material, electric field stress, high power density, field grading materials, nonlinear field-dependent conductivity layerThis paragraph of the first footnote will contain the date on which you submitted your paper for review, which is populated by IEEE.

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Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

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“…After systematically analysing the relationship between modules and equipment in the substation and evaluating the state of all equipment, a modular substation fault tree model is established, as shown in Figure 2. Based on the fault tree and Boolean algebra operation method, the expression of module average failure probability is shown in equation ( 7) [18].…”

Section: Fault Tree Modelmentioning

confidence: 99%

Intelligent Operation Maintenance Strategy for Modular Substation Based on Fault Tree Method

Zheng

Hong

et al. 2023

J. Phys.: Conf. Ser.

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Modular substations meet the development trends of the power transmission system. However, the operation maintenance strategy for the modular substation is still lacking. Herein, an intelligent operation maintenance strategy for the modular substation is proposed based on the fault tree method. After rating the state of components in the equipment, the state of the equipment is obtained. Subsequently, by analyzing the relationship between the equipment and modules in the substation, a fault tree model is established to calculate the risk value of each module. Eventually, based on the proposed operation maintenance time model, the optimal operation maintenance cycle of each module under different states is calculated and the intelligent operation maintenance strategy is put forward. This paper is helpful to improve the efficiency and quality of operation maintenance for modular substations.

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“…Epoxy resin insulation materials, a kind of polar polymer material, have been extensively applied in many electrical equipment such as power electronic packaging, − outdoor insulation, − and power cable , due to the excellent insulation strength, mechanical properties, and processability. The epoxy resin encapsulated products are inevitably invaded by moisture or water during long-term service, leading to the deterioration of the epoxy resin insulation materials.…”

Section: Introductionmentioning

confidence: 99%

Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments

Liu,

Lin,

Zhang

et al. 2024

Langmuir

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The unclear understanding of the water diffusion behavior posts a big challenge to the manipulation of water absorption properties in epoxy resins. Herein, we investigated the water diffusion behavior and its relationship with molecule structures inside an epoxy resin mainly by the nonequilibrium molecular dynamics and experiments. It is found that at the initial rapid water absorption stage, bound water and free water both contribute, while at the later slow water absorption stage, free water plays a dominant role. The observed evolution of free water and bound water cannot be explained by the traditional Langmuir model. In addition, molecule polarity, free volume, and segment mobility can all influence the water diffusion process. Hence, the epoxy resin with low polarity and high molecular segment mobility is endowed with higher diffusion coefficients. The saturated water absorption content is almost dependent on the polarity. The understanding of how water diffuses and what decides the diffusion process is critical to the rational design of molecule structures for improving the water resistance in epoxy resin.

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Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves

Cited by 18 publications

References 37 publications

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Intelligent Operation Maintenance Strategy for Modular Substation Based on Fault Tree Method

Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments

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