Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits

Müller, Jens; Perrone, R.; Thust, Heiko; Drüe, Karl-Heinz; Kutscher, C.; Stephan, Ralf; Trabert, Johannes; Hein, Matthias; Schwanke, Dieter; Pohlner, J.; Reppe, G.; Kulke, R.; Uhlig, Peter; Jacob, Arne F.; Baras, T.; Molke, A.

doi:10.1109/estc.2006.279987

Cited by 24 publications

(8 citation statements)

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“…For higher harmonics (n > 1), there will be a discrete set of resonances at frequencies: (14) If the TL section is realized as cascaded LC unit cells [9], [12], the higher harmonics will be suppressed in the frequency range f > f CR for f n and f < f CL for f -n .…”

Section: Multi-band Zero-order Resonatormentioning

confidence: 99%

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Multi-band and tunable multi-band microwave resonators and filters based on cascaded left/right-handed transmission line sections

et al. 2009

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Design of microwave devices based on a combination of traditional right-handed transmission line sections with positive dispersion and metamaterial lefthanded transmission line sections with negative dispersion is considered. Compared to homogeneous transmission lines, the use of cascaded line sections gives additional degrees of freedom for the design of microwave devices with enlarged functionality and unique performance. Artificial right-and left-handed transmission lines based on lumped-element equivalent cells help to minimize the dimensions of microwave devices. For filters, a combination of cascaded right-and left-handed transmission lines can be applied advantageously, to control the position and the widths of the individual pass-bands and the parasitic response of higher harmonics. This paper describes the theoretical approach to the design of multi-band resonators and filters with highly suppressed response of higher harmonics. Selected devices were manufactured as three-dimensional ceramic multilayer modules based on low-temperature co-fired ceramic technology. The results of numerical simulation and experimental investigation of these devices are compared. Furthermore, the employment of variable capacitors in single cells of artificial transmission lines provides frequency tuning of the devices. The design of tunable dual-band filters is discussed, and the experimental results are presented.

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Section: Multi-band Zero-order Resonatormentioning

confidence: 99%

“…Two successive stages are considered: i) The design of the devices and the analysis of their reproducible fabrication based on the multilayer low-temperature co-fired ceramic (LTCC) technology [14]- [16]. ii) The investigation of the tunability of the devices.…”

Section: Introductionmentioning

confidence: 99%

Multi-band and tunable multi-band microwave resonators and filters based on cascaded left/right-handed transmission line sections

et al. 2009

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“…Photographically masked thin films allow finer-line geometries to be achieved which are helpful for higher frequency microwave and millimeter wave circuit operation [5], although issues with manufacturability must be addressed. Within the manufacturing domain, it is well known that chemical reactions between the thin film and ceramic substrate are necessary for strong adhesion to the ceramic substrate [6].…”

Section: Multilayered Thin-film Metal Systemsmentioning

confidence: 99%

“…The effective surface resistance in the Cu layer can now be defined as (5) and the current in the Cu layer becomes…”

Section: B Analytic Modeling Of Stacked-metal Lossesmentioning

confidence: 99%

Metal Layer Losses in Thin-Film Microstrip on LTCC

Fund

Kuhn

Wolf

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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Thin-film microstrip transmission lines fabricated using a Ti adhesion layer followed by layered Cu, Pt, and Au films are measured to determine tradeoffs between manufacturability issues and microwave performance. Since Ti metal has approximately 25 times the resistance of Cu, and currents in a microstrip line flow mainly at the interface with the substrate where the Ti is located, there is the possibility of increased RF signal losses with this structure. It is found that Ti adhesion layers of ≤200-nm thickness cause minimal loss through 40 GHz on DuPont 9K7 low-temperature cofired ceramic substrates, so there is no significant electrical penalty for employing a metal stackup optimized for mechanical durability. These measurements, together with analysis and simulations suggest this will hold in general as long as the thinner, higher resistance adhesion metal is well below one skin depth in thickness at the operating frequency.

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“…To meet the conditions for more accurate structural resolution, the sintered thick-film pastes can alternatively be etched, as presented in [6,7]. Another way to fabricate fme-line structures with a resolution down to 30 /lm for lines and spaces using screen printing techniques takes advantage of photo-imageable pastes such as the Fodel® system [4,8].…”

Section: Thin-film Technologymentioning

confidence: 99%

Fine-line structuring of microwave components on LTCC substrates

Stöpel

Drüe

Humbla

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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Low Temperature Co-fired Ceramics (LTCC) are used in a wide range of RF and microwave applications. The ceramic multilayer technology provides a truly three-dimensional circuit technology, hermetical sealing, hybrid integration, and favorable microwave properties at moderate costs. In order to take advantage of high frequencies with guided wavelengths of the order of millimeters, a precision of lines and spaces better than the resolution of 50 /lm available with standard patterning methods is crucial. Examples of relevant L TCC-modules are filters, couplers, and resonators, e.g., for the Ka-band frequency range (17-22 GHz satellite downlink). Our recent work in the project KERAMIS (ceramic microwave circuits for satellite applications) aims for the verification of the LTCC-modules in space [1,2]. The manufacturing of these modules is based on screen printing and, therefore, the structural precision is limited to approximately 10 /lm. Microwave designs with lines and spaces of 50 /lm hence result in geometrical differences of up to 20%. This is the major drawback of using narrow linewidths. To overcome this drawback, several techniques can be applied. One can use special trampoline screens or special mesh coatings [3][4][5]. Another method to achieve higher resolutions with good repeatability is the use of imageable pastes such as Fodel®. Furthermore, etching of thick film conductors and thin films on LTCC can be used. This paper describes yet another promising approach, namely the investigation of a fme-line structuring process in combination with thin-film and thick-film technologies. The new process replaces the commonly used expensive sputtered layers required for thin-film structuring by standard LTCC-technology. The initial layer is replaced by a screen printed metallo-organic (resinate) paste, a noble metal compound (e.g. gold or silver) that is dissolved in organic suspensions. The film thickness after firing is typically below l/lm. This layer can be used to defme structures with high precision using photolithography and electroplating followed by an etching process. The etching processes investigated here showed promising resolutions of 20 /lm for lines and spaces. The benefits for the design of microwave device applications are obvious given an improved resolution and parameter spread and an accordingly reduced variation of the resulting structures. Microwave filters are in preparation to demonstrate the advantages of this new structuring method on a quantitative level.

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Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits

Cited by 24 publications

References 0 publications

Multi-band and tunable multi-band microwave resonators and filters based on cascaded left/right-handed transmission line sections

Multi-band and tunable multi-band microwave resonators and filters based on cascaded left/right-handed transmission line sections

Metal Layer Losses in Thin-Film Microstrip on LTCC

Fine-line structuring of microwave components on LTCC substrates

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