Technological Aspects of the Process of Development of Advanced Radioelectronic Products

Батьковский, М. А.; Леонов, В. Н.; Пронин, Ю.; Fomina, V. V.

doi:10.21778/2413-9599-2016-4-135-145

Cited by 2 publications

(1 citation statement)

References 1 publication

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“…Figure 1 shows the geometric parameters of some types of switching structures [1]. Currently, the increasing complexity of electronic equipment and its miniaturization lead to a shift in the geometric dimensions of switching structures in the microand nano-area [12]- [14]. The reduction of the size of electrical connections reduces the attenuation and signal distortion.…”

Section: Methodsmentioning

confidence: 99%

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

Chernov¹,

Kondakov²,

Perederin³

et al. 2020

Int. J. Adv. Sci. Eng. Inf. Technol.

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The application features of the Via-in-Pad method when implementing a high-density conductive pattern of multilayer switching structures in electronics is considered herein. The composition method for vias and contact pads for the tracing ability improvement is proposed, and the assessment methodology for the effective area utilization for BGA components is presented. The experimental study of the pressure sensor housing was carried out, which showed that the application of this method made it possible to reduce the number of vias by 40% and place more contact pads per unit area, which frees up the gaps for BGA tracing, reduces the pattern density and microwave signal paths. The obtained results confirmed the possibility of reduction of the usable space by 25%, which makes it possible to arrange more pads per unit area, to free up the gaps for BGA tracing, to reduce the time for drilling the workpieces, to reduce the number of used drills, and also provides the best heat removal from the components. The disadvantage is the large internal resistance of the transitions created by the Via-in-Pad method, in contrast to the standard ones, which can negatively affect the flow of critical signals. By comparing the resistances from the metallization layer of the via in the MPCB with a flexible flat cable and in the MPCB designed using the Via-in-Pad method, it was found that the Via-in-Pad method made it possible to increase the layout efficiency of multilayer printed circuit boards.

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Section: Methodsmentioning

confidence: 99%

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

Chernov¹,

Kondakov²,

Perederin³

et al. 2020

Int. J. Adv. Sci. Eng. Inf. Technol.

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The concept of using additive technologies for digital prototyping of assembly devices

Vlasov

Juravleva

Ismagilov

2022

J. Phys.: Conf. Ser.

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The article discusses the main provisions of the concept of using additive technologies for digital prototyping of assembly devices in the production of electronic equipment. Approaches to the system design of devices and their components are formulated. General ideas about devices are generalized and systematized, types of fixtures for assembling electronic equipment are classified. A comparative analysis of the methods of classical and model-oriented (drawing-free) design is carried out. Recommendations on the use of additive technologies in the implementation of ‘trial and error’ design methods, the coordinate calculation method, wave technology, design using layout schemes and virtual assembly are given. The tasks that are solved in the process of designing and manufacturing devices in the production of electronic equipment are determined. Recommendations for modeling, simulation and prototyping of devices for testing designs and validating technological processes in order to reduce the time of technological preparation and production are given.

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Technological Aspects of the Process of Development of Advanced Radioelectronic Products

Cited by 2 publications

References 1 publication

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

The concept of using additive technologies for digital prototyping of assembly devices

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