Technological Approaches for Formation of High-Density Integral Capacitors: Deep Etching and Atomic Layer Deposition

Miakonkikh, A.; Pankratov, S.; Kuzmenko, V.; Rudenko, K.

doi:10.1134/s1063739723600863

Russ Microelectron

2023

DOI: 10.1134/s1063739723600863

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Technological Approaches for Formation of High-Density Integral Capacitors: Deep Etching and Atomic Layer Deposition

A. Miakonkikh,

S. Pankratov,

V. Kuzmenko

et al.

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Technological Approaches for Formation of High-Density Integral Capacitors: Deep Etching and Atomic Layer Deposition

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