2009
DOI: 10.1021/ac802450u
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Technique for Microfabrication of Polymeric-Based Microchips from an SU-8 Master with Temperature-Assisted Vaporized Organic Solvent Bonding

Abstract: Novel means of fabricating polymeric microfluidic devices are presented. An SU-8 master is applied in two-stage embossing, followed by vaporized organic solvent bonding. The primary master is created by standard photolithography; the inexpensive SU-8 primary master is used in a two-stage process to generate microfeatures in hard polymers. A vaporized solvent bonding technique that readily produces complete microfluidic chips, without the need of a sacrificial layer to prevent channel deformation, was used to f… Show more

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Cited by 41 publications
(34 citation statements)
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“…Sofla and Martin presented a vapor assisted PDMS to glass substrate bonding method using fluoroalkyl trichlorosilane vapor (56). Vaporized organic solvent and temperature assisted bonding of hard and soft polymer have been reported by Koesdjojo et al and used for HPLC applications (57). The Zengerle group reported bonding of 3D polystyrene microfluidic structures (58).…”
Section: Technologymentioning
confidence: 99%
“…Sofla and Martin presented a vapor assisted PDMS to glass substrate bonding method using fluoroalkyl trichlorosilane vapor (56). Vaporized organic solvent and temperature assisted bonding of hard and soft polymer have been reported by Koesdjojo et al and used for HPLC applications (57). The Zengerle group reported bonding of 3D polystyrene microfluidic structures (58).…”
Section: Technologymentioning
confidence: 99%
“…Microchips were fabricated from PMMA using a two-step embossing and solvent welding technique described previously [26,27]. The design of the microchip is shown in Fig.…”
Section: Microfluidic Device Fabricationmentioning
confidence: 99%
“…Thermoplastic bonding is one of the most simple and straightforward thermoplastic processes [23]; however, it imparts a low bonding strength. Therefore, high-strength bonding techniques using materials such as solvents [27], adhesives [28], UV/Ozone [29], O2 plasma [30], as well as welding [31] have been reported. Each polymer-replication or bonding technique presents specific advantages as well as process limitations for different applications.…”
Section: Introductionmentioning
confidence: 99%