TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

Ma, Yenai; Delshadtehrani, Leila; Demirkiran, Cansu; Abellán, José Luis; Joshi, Aiav

doi:10.23919/date51398.2021.9474011

Cited by 19 publications

(1 citation statement)

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“…Thermal simulators for SoCs, such as HotSpot [15] and 3D-ICE [16], employ thermal equivalent resistors and capacitors to build thermal models. These state-of-the-art tools have paved the way for previous studies [17], [18] to analyze thermal profiles of chiplet systems. However, they typically instantiate a homogeneous layer of material that is then partitioned into smaller thermal grids for simulation.…”

Section: B Thermal Modeling Of Chiplet-based Systemsmentioning

confidence: 99%

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

Medina,

Huang,

Ansaloni

et al. 2023

2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC)

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2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they introduce a new bottleneck in inter-chiplet communication, which must be routed through the interposer. Such a constraint favors mapping related tasks on computing cores within the same chiplet, leading to thermal hotspots. Inpackage wireless technology holds promise to reconsider such a position because integrated wireless antennas provide low-latency and high-bandwidth communication paths, thus bypassing the interposer bottleneck. Furthermore, in this work, we propose a new task mapping heuristic that leverages in-package wireless technology to improve the thermal behavior of 2.5D SoPs executing complex applications. Combining system simulation and thermal modeling, our results show that we can distribute computation in wireless 2.5D SoPs to reduce peak temperatures by up to 24% through task mapping with a negligible performance impact.

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