Tailoring of thermal and dielectric properties of LDPE-matrix composites by the volume fraction, density, and surface modification of hollow glass microsphere filler

Investigation of thermal conductivity and dielectric properties of LDPE-matrix composites filled with hybrid filler of hollow glass microspheres and nitride particles

“…The improvement of the interfacial adhesion between filler and LDPE also implies stronger interaction between filler and LDPE, which will reduce the mobility of some of the free polar groups in LDPE, leading to reduction in the D k of the composites [27,45,46]. The lower D f of modified-filler filled composites when compared with that of pristine filler filled composites can be also attributed to the improved interfacial adhesion between filler and LDPE [31,47].…”

“…Compared with composites filled with only nitride particles or HGMs [31,48], the composites filled with a hybrid filler of nitride particles and HGMs exhibit the thermal conductivity and dielectric properties that may be adjusted in a larger range by varying the volume ratio of nitride particles to HGMs. Considering the balance between thermal conductivity and dielectric properties of the composites, the ratio of 1:1 is chosen as the optimal volume ratio of nitride particles to HGMs in subsequent experiments.…”

“…As an often used filler, hollow glass microsphere (HGM) consists of outer glass and inner inert gas, which results in lower D k and thus it can be used to modify the dielectric properties of the polymer-matrix composites [28][29][30][31][32][33]. However, it is obvious that the thermal conductivity of the composites decreases due to lower thermal conductivity of HGM if only HGM filler is filled into the composites [31][32][33][34][35]. In our previous study, nitride (AlN or BN) particle and HGM were simultaneously filled into epoxy matrix, and resultant composites had higher thermal conductivity as well as lower D k and D f than those of epoxy matrix [36].…”

Dielectric properties of modified BNT/PTFE composites for microwave RF antenna applications

“…PEEK [3], PVDF [4], PPS [5], PS [6], HDPE [7], LDPE [8], PVB [9], POE [10], epoxy [11], silicone rubber [12] are also used, but they all have higher tangent loss than PTFE. But applications are limited as the polymer has low dielectric constant and high coefficient of thermal expansion [13].…”

Hollow glass microsphere as a light‐weight composites with good gas barrier property

“…There have recent investigations of low dielectric permittivity and high thermal stability composites based on polymers and HGM [9,10]. Deposition of silver uniform shells on the titanium (IV) tetra-n-butoxide modified surface of sodium borosilicate HGMs has produced highly reflective materials with the conductivity of the precious metal but without the high cost or weight [11].…”