Adhesion in Microelectronics 2014
DOI: 10.1002/9781118831373.ch3
|View full text |Cite
|
Sign up to set email alerts
|

Tailoring of Interface/Interphase to Promote Metal‐Polymer Adhesion

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2015
2015
2022
2022

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 14 publications
(1 citation statement)
references
References 133 publications
0
1
0
Order By: Relevance
“…Unfortunately, the bonds formed between cyanoacrylate and HDPE are mechanically weak with large sample to sample strength variation, causing the performance of the end product to suffer drastically [2, 3]. The low bond strength between these materials derives from the absence of polar groups on the polymer surface and the weak chemical interaction between the polymer and adhesive [6, 7]. …”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, the bonds formed between cyanoacrylate and HDPE are mechanically weak with large sample to sample strength variation, causing the performance of the end product to suffer drastically [2, 3]. The low bond strength between these materials derives from the absence of polar groups on the polymer surface and the weak chemical interaction between the polymer and adhesive [6, 7]. …”
Section: Introductionmentioning
confidence: 99%