Tabulation of the BRT function for the thermal conductivity ratio and the AG function for the depression of the critical temperature

Ramos, Eduardo; Sánchez, Daniel H.

doi:10.1016/0011-2275(74)90114-3

Cited by 9 publications

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“…When the temperature dependence of the gap is taken into account [10], d* is given by and the BJ expression (Equations (5) and (6)) is still valid. Using the values of [A(T = 0)/A(T)] for a BCS superconductor [13] it is possible to show that the correction is small in our case. Figure 6 shows a plot of le versus T for both samples, together with the BJ prediction for 20 single junctions in parallel calculated using equation (5) and [14] '0 (In) = 2 600 Á, A(0) = 1.82 kB T,, (In) ; Tc (In) = 3.407 K and ne = 11.5 x 1028 electrons/m3.…”

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confidence: 75%

Finite size arrays of proximity effect bridges

Berchier

Sánchez

1979

Rev. Phys. Appl. (Paris)

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We have studied devices consisting of 20 x 20 two dimensional arrays of proximity effect junctions of Au/In. The DC resistance at the origin as a function of temperature shows a transition at Tc (In) and another one at T*c, below Tc (In) but above Tc (Au/In). At T*c the devices go into a resistanceless state even though they are composed of SNS junctions. Different shapes of the current-voltage curves characterize each temperature region

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confidence: 75%

Finite size arrays of proximity effect bridges

Berchier

Sánchez

1979

Rev. Phys. Appl. (Paris)

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“…(20) gk ----t~ (e (k i) --/.t) e'trkVkE (21) The evaluation of rk is again specific to our problem. We note first that Nk is the number of electrons in region I with momentum k in dak: (22) This number is changed since electrons are reflected from k to k' at the right interface of region I and since electrons with k' are reflected to k at the left interface of region I. Thus one has dNk = --FdtJvk,z[fk d3k (1 --];k,)g2 + Fdt[Vk,~[fk , d3k ' (1 --fk)R 2 (23) According to (22) and using IVk.~ J= IVk*.zl and d3k = d3k ', we get from (23) with (19) and (20) Ogk …”

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confidence: 99%

Thermal conductance of metal interfaces at low temperatures

1980

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In the present work the dependence of the heat transfer coefficient between Cu and Sn, Cu and Pb, and Cu and W on the temperature and an external magnetic lieM has been measured. The preparation of the metal-metal junctions has been performed by melting so that a close contact at the interface was guaranteed. The heat transfer coefficient has been found by a steady-state measuring method. In the case of the Cu-Pb junction the heat transfer coefficient could be measured both in the superconducting and normal states. For all the metal-metal junctions in the normal state a linear temperature dependence of the heat transfer coefficients on the temperature has been found. In the superconducting state a strong reduction of the heat transfer coefficient has been observed. In addition, a theoretical calculation of the heat transfer coefficient on metal-metal interfaces is given. First we consider the scattering of electrons on a steplike potential barrier between two gases of free electrons. Then the thermal conductance due to scattering in an alloy layer is calculated. Such an alloy layer may arise from diffusion during the contact preparation. Comparison of these two cases with the experiments shows the thermal conductance at the interface is mainly determined by the electron scattering on lattice irregularities in the diffusion layer.

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Thermal conductivity of the Kondo superconductor Zn-Mn

Sánchez

1974

J Low Temp Phys

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Tabulation of the BRT function for the thermal conductivity ratio and the AG function for the depression of the critical temperature

Cited by 9 publications

References 4 publications

Finite size arrays of proximity effect bridges

Finite size arrays of proximity effect bridges

Thermal conductance of metal interfaces at low temperatures

Thermal conductivity of the Kondo superconductor Zn-Mn

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