1999
DOI: 10.1063/1.123854
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Ta 2 O 5 thin films with exceptionally high dielectric constant

Abstract: Simulation and dielectric characterization of reactive dc magnetron cosputtered ( Ta 2 O 5 ) 1−x ( TiO 2 ) x thin films J.

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Cited by 119 publications
(73 citation statements)
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“…Recently, promising applications of Ta promoted even greater interests [4]. Although much research effort has been devoted to the structural and electrical properties of the materials, as-deposited Ta 2 O 5 thin films still suffer from the crystallization difficulty and poor electrical properties [5][6][7][8]. Generally, it is necessary to deposit or anneal at high temperature in order to improve the structure and properties of Ta 2 O 5 thin films on Si substrates.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, promising applications of Ta promoted even greater interests [4]. Although much research effort has been devoted to the structural and electrical properties of the materials, as-deposited Ta 2 O 5 thin films still suffer from the crystallization difficulty and poor electrical properties [5][6][7][8]. Generally, it is necessary to deposit or anneal at high temperature in order to improve the structure and properties of Ta 2 O 5 thin films on Si substrates.…”
Section: Introductionmentioning
confidence: 99%
“…Ru is used as an electrode for these dielectric materials due to its dry etchability and high conductivity under oxidizing conditions. [5,6] Recently, a Ta 2 O 5 film grown on a Ru(002) film and annealed at 800 C [7] was found to have a dielectric constant at its highest level of 110, due to the delocalized electrons in the hexagonal crystal structure. [8] Considering process maturity, feasibility, and reliability, [9] Ru±Ta 2 O 5 ±Ru is regarded as an attractive structure for a metal±insulator±metal (MIM) capacitor.…”
Section: Introductionmentioning
confidence: 99%
“…[8] Considering process maturity, feasibility, and reliability, [9] Ru±Ta 2 O 5 ±Ru is regarded as an attractive structure for a metal±insulator±metal (MIM) capacitor. Although a Ru thin film grown by physical vapor deposition (PVD) has good material characteristics, [7] it has to be grown by CVD to meet the step coverage required for the bottom electrode of a DRAM capacitor. [6] Studies of Ru MOCVD began only in the last few years, and its deposition mechanism has not yet been clearly established.…”
Section: Introductionmentioning
confidence: 99%
“…Ruthenium is one of the most promising candidate electrode materials for some capacitors dielectrics [4][5][6]. Ru and RuO 2 thin films have been receiving much attention because of their good conductivity, low temperature coefficient of resistance (TCR), and high thermal stability [7].…”
Section: Introductionmentioning
confidence: 99%