T-Rex, a blade packaging architecture for mainframe servers

Katopis, G.A.; Becker, W.D.; Harrer, H.

doi:10.1109/tadvp.2004.841649

Cited by 10 publications

(5 citation statements)

References 5 publications

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“…Efficient datacenter integration of various servers is made possible by standard packaging dimensions such as rackmount [7] servers and BladeCenter [8,9,10].…”

Section: Scalability Linksmentioning

confidence: 99%

“…Capacitor Pad Size Differential Return Loss (dB) 10.00 The 0201 capacitor had the best SDD21 ( Figure 9) and SDD11 ( Figure 10) The difficulty of obtaining crisp differentiation is partially attributed to the lack of ground vias around the transitions. A measured differential TDR shows small differences between the reflection profiles of the 4 designs ( Figure 16).…”

Section: Capacitor Padsmentioning

confidence: 99%

“…Via Transition Differential Return Loss (dB) 10 Capacitor Cutouts Large capacitor pad size relative to the transmission line width results in an impedance discontinuity. This is typically addressed through reduction of the parallel plate capacitance effect that exists between the pad and the reference plane below through voids.…”

Section: Capacitor Padsmentioning

confidence: 99%

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Electrical-Optical High Speed Serial Server Scalability Link

Araujo¹,

Cases²,

Kuchta³

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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Increased demand for performance has driven a significant increase in the data rate and the complexity of today's high speed systems and interconnect. While skin effects and dielectric loss are significant sources of limitation of current high-speed digital communication [1], equalization at the transmitter, receiver, and interconnect has extended the range and performance of copper links. Electrical copper links are typically used to interconnect multiple processor subsystems to build symmetric multi-processor (SMP) systems, as well as to connect input/output (I/0) subsystems across relative long distances.During the electrical design and validation of a highly scalable, modular SMP server [3] with data rates of 3.2 GT/s (GigaTransfers per second) and higher, a test vehicle was designed and built. The goal was to characterize and contrast an all-copper external cable and a copper-to-optical interconnect technology, and to understand how to achieve the overall system design goals from the perspective of link performance, electrical challenges, and physical design constraints.Key design parameters have been modeled and correlated with laboratory measurements such as AC coupling capacitor selection and layout optimization, via stub, back-drilling, and signal launch effects. Modeling techniques and correlation challenges are discussed in this paper.

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“…Efficient datacenter integration of various servers is made possible by standard packaging dimensions such as rackmount [7] servers and BladeCenter [8,9,10].…”

Section: Scalability Linksmentioning

confidence: 99%

Section: Capacitor Padsmentioning

confidence: 99%

See 1 more Smart Citation

Electrical-Optical High Speed Serial Server Scalability Link

Araujo¹,

Cases²,

Kuchta³

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

View full text Add to dashboard Cite

show abstract

“…Scalability Links Integration of various servers in a datacenter is made possible by standard packaging dimensions such as rackmount [6] servers and BladeCenter [7,8,9]. These standard form factors allow for the integration of systems of various vendors and capabilities in a scalable and easily to deploy manner.…”

Section: IImentioning

confidence: 99%

Electrical-Optical High Speed Serial Server Scalability Link

Araujo¹,

Cases²,

Kuchta³

et al.

56th Electronic Components and Technology Conference 2006

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Increased demand for performance continues to drive higher chip internal clock frequencies and parallelism, as well as raise the demand for higher bandwidth and lower latencies. Today's copper digital communication links are limited by their loss characteristic which are dominated at high data rates by skin effects and dielectric loss [1]. Electrical copper links are typically used to interconnect multiple processor subsystems to build symmetric multi-processor (SMP) systems, as well as to connect input/output (I/O) subsystems across relative long distances.This paper describes the electrical design, challenges, and validation encountered during the design of a highly scalable, modular SMP server [2] with data rates of 3.2 GT/s (GigaTransfers per second) and higher. It contrasts the allcopper external cable and copper-to-optical interconnect technology to achieve the overall system design goals from the perspective of link performance, electrical challenges, and physical design constraints. Key design parameters such as AC coupling capacitor selection and layout optimization, via stub and antipad effects, and raw card materials are discussed in this paper. Scalability Cables Front of ServerBack of Server Scalability Controller 28" Chassis Depth Internal Copper Cable Front Back Front BackAs can be seen in Figure 3, the 3.2 Gbps Scalability link topology has to traverse 2 packages, 2 CPU cards, 2 HmZD cartridge connectors, 2 internal cable cartridges, two external connectors and one external cable.

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“…This report will show that the BladeCenter system take less space and places the enterprise server infrastructure within easy reach of the administrator. BladeCenter provides modular scalability, versatility in server types, improved reliability, availability, and serviceability(RAS) functions, system management enhancements and thermal advantages [1]. Potential cost savings are listed last.…”

Section: Introductionmentioning

confidence: 99%

Data center server packaging technology

Patel

Herrman

Hughes

et al.

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

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The purpose of this paper is to describe BladeCenterTM packaging technology and compare with lU and 2U rack systems to illustrate the improvements. The power and thermal design challenges are described. The paper covers in detail power and thermal design advantages, and overall cost performance compared to IU servers.A blade server is a rack-optimized server architecture designed to include the benefits of standardized IU rack systems while eliminating the complications associated with these systems. The term BladeCenter refers to a chassis that can hold a number of hot-swappable devices called blades server. A blade sever is an independent server containing one or more processors, memory, disk storage, and network controllers The BladeCenter was created to simplify the deployment of servers in an enterprise infrastructure.

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T-Rex, a blade packaging architecture for mainframe servers

Cited by 10 publications

References 5 publications

Electrical-Optical High Speed Serial Server Scalability Link

Electrical-Optical High Speed Serial Server Scalability Link

Electrical-Optical High Speed Serial Server Scalability Link

Data center server packaging technology

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