Systematic prediction method for flip-chip bonding connectivity of ultra-large array infrared detector
Huihao Li,
Jindong Wang,
Yan Chen
et al.
Abstract:The flip-chip bonding technique utilized in ultra-large array infrared detectors has a substantial impact on connectivity rates. The electrical connectivity of the flip-chip bonding process exhibits randomness due to the difficulties in the surface control of large-scale devices. This restriction hinders the development of ultra-large array devices. In this work, the surface shape matching calculation is performed based on the surface shape distributions measured from infrared detector chips and readout circui… Show more
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