Abstract:One of the key advantages to replace bare Cu wire with Pd Cu wire in semiconductor packages is to reduce corrosion risk against halogen from mold compound or substrate soldermask outgasing. However, existing wire bond recipe development methodology adopted from bare Cu wire was less effective for Pd Cu due to harder Free Air Ball (FAB) with Pd Cu wire, causing Pd Cu bond failure after biasing reliability stress such as HAST. This study is aimed to obtain a proper methodology in developing a reliable Pd Cu wire… Show more
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