System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Nafis, Bakhtiyar Mohammad; Iradukunda, Ange-Christian; Huitink, David

doi:10.1115/1.4047497

Cited by 8 publications

(4 citation statements)

References 14 publications

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“…On the other hand, the low thermal conductivity of PCMs can decrease the heat transfer efficiency of TMS, and the heat transfer enhancement techniques play an important role when using PCMs. For example, Nafis et al [156] investigated the thermal performance of a passive heat sink filled with PCMs via numerical simulations. It was shown that a more uniform temperature distribution with lower peaks and smaller temperature fluctuations could be obtained by using a PCM, such as xylitol.…”

Section: Phase Change Materials (Pcms)mentioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

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In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction. Very similarly, the aviation industry is developing towards more electric aircraft (MEA) in response to the reduction in global CO2 emission. To promote this technology revolution and performance advancement, plenty of electronic devices with high heat flux are implemented on board automobiles and aircraft. To cope with the thermal challenges of electronics, in addition to developing wide bandgap (WBG) semiconductors with satisfactory electric and thermal performance, providing proper thermal management solutions may be a much more cost-effective way at present. This paper provides an overview of the thermal management technologies for electronics used in automobiles and aircraft. Meanwhile, the active methods include forced air cooling, indirect contact cold plate cooling, direct contact baseplate cooling, jet impingement, spray cooling, and so on. The passive methods include the use of various heat pipes and PCMs. The features, thermal performance, and development tendency of these active and passive thermal management technologies are reviewed in detail. Moreover, the environmental influences introduced by vibrations, shock, acceleration, and so on, on the thermal performance and reliability of the TMS are specially emphasized and discussed in detail, which are usually neglected in normal operating conditions. Eventually, the possible future directions are discussed, aiming to serve as a reference guide for engineers and promote the advancement of the next-generation electronics TMS in automobile and aircraft applications.

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Section: Phase Change Materials (Pcms)mentioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

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“…Due to its thermal storage properties, utilizing PCM in PE packaging has the potential to aid in thermal management [6]. PCMs work by absorbing heat from the surrounding while rising to its transition temperature, then undergoing a constant temperature phase change while continuing to absorb heat [7]. PCM incorporated into PE packaging can effectively store heat dissipated by the devices during its transient operation via phase change from solid to liquid (or in some cases solid to solid) transformations, lowering the peak junction temperature in the device [8].…”

Section: Background and Motivationmentioning

confidence: 99%

“…While there have been reviews of both PCMs [9] and packages [5] for automotive PE, there are limited studies on performance of PCMs under the transient conditions devices will be exposed to during operation. Power pulses have been used to evaluate the viability of PCM as a source of supplemental cooling in PE packages, but only model a single PCM (Xylitol) in the study [7]. This paper investigates the effects of incorporating PCM into both single-sided and dual-sided power electronics packages.…”

Section: Research Objectivesmentioning

confidence: 99%

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Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Hollis

Sharar

Bandhauer

2021

Journal of Electronic Packaging

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High temperature silicon carbide (SiC) die are the most critical and expensive component in electric vehicle (EV) power electronic packages and require both active and passive methods to dissipate heat during transient operation. The use of phase change materials (PCMs) to control the peak junction temperature of the SiC die and to buffer the temperature fluctuations in the package during simulated operation is modeled here. The latent heat storage potential of multiple PCM and PCM composites are explored in both single-sided and dual-sided package configurations. The results of this study show that the addition of phase change material (PCM) into two different styles of power electronics (PE) packages is an effective method for controlling the transient junction temperatures experienced during two different drive cycles. The addition of PCM in a single-sided package also serves to decrease temperature fluctuations experienced and may be used to reduce the necessary number of SiC die required for EVs, lowering the overall material cost and volume of the package by over 50%. PCM in a single-sided package may be nearly as effective as the double-sided cooling approach of a dual-sided package in the reduction of both peak junction temperature of SiC as well as controlling temperature variations between package layers.

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Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins

Theeb,

Hussain

2024

Heat Trans

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This study introduced a novel numerical modeling for the evaluation of a hybrid heat sink design by replacing the solid fins with aluminum foam fins (AFF) for the same thickness of 2 mm within a phase change material (PCM). This innovation is designed to enhance thermal performance in electronic cooling applications. Heat fluxes of 2, 3, and 4 kW/m2 were applied to the base. The performance has been verified at set point temperatures (SPT) of 60°C, 70°C, and 80°C, encompassing a range relevant to various applications. Different AFF thicknesses (4 and 6 mm) and foam porosities (0.85, 0.90, and 0.95) were investigated. The study demonstrated that AFFs improve heat transfer by increasing fin surface area and by effectively raising the thermal conductivity of the PCM. Compared to the SF heat sink, the results show that the AFF design extended the operational time by 5%–8% for the range of heat fluxes. Notably, AFFs with a thickness of 6 mm achieved a significant 41% improvement in the operation time at a lower SPT (60°C). The metal foam porosity of ε = 0.85 exhibited superior thermal performance within the investigated temperature range. This research paves the way for optimizing hybrid heat sink designs using metal foam for efficient thermal management and reduction of weight.

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System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Cited by 8 publications

References 14 publications

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins

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