Abstract:Two kind of on-chip integrated fatigue bending test structures are designed through system-level simulation method based on macromodels to measure the fracture strength and fatigue mechanical properties of polysilicon thin films. The first on-chip fatigue test structure is actuated by V-beam thermal actuator, and the other test structure actuated by electrostatic comb. The static and dynamic analysis was performed by Coventorware Architect module using self-bulid reduced order model described with the MAST har… Show more
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