System-Level Analysis for Integrated Power Amplifier Design in mmWave Consumer Wireless Communications

Abstract

System-level specifications for the design of integrated power amplifiers in mmWave wireless communications are derived in the paper. To this aim emerging standards for consumer applications such as wireless ultra-high definition (UHD) multimedia streaming or Gbit wireless LAN are considered (WirelessHD, WiGig, ECMA387, IEEE.802.11.ad, IEEE802.15.3c and upcoming 5G). A power amplifier design in 65 nm CMOS Silicon on Insulator (SOI) technology, targeting a 9 GHz UWB window from 57 to 66 GHz, is also proposed. To increase the power delivered to the antenna up to 18 mW, being still in the limit of maximum 1dB compression point, multiple PA cores have been combined through a Wilkinson power combiner, but other solutions can be also explored for a better power efficiency and linearity.

Design of a Wideband Antenna for Wireless Network-On-Chip in Multimedia Applications

“…As a matter of fact, using scaled CMOS (Complementary Metal Oxide Semiconductor) technologies, there are several works published in literature, operating from a few GHz to mm-waves, which already integrate on-chip the transmitter and the receiver, see Ref. [45][46][47][48][49][50][51][52][53][54][55]. Also, for the Analog-Digital converter [45,55] and for the building blocks of a NoC (e.g., NI, Router, Link in [23][24][25][26][27][28][29][30][31][32][33]) there are many works proposing on-chip integrated solutions.…”