System in Package (SiP) With Reduced Parasitic Inductance for Future Voltage Regulator

Hashimoto, Takayuki; Shiraishi, Masaki; Akiyama, Nobuyuki; Kawashima, T.; Uno, T.; Matsuura, N.

doi:10.1109/tpel.2009.2013225

Cited by 22 publications

(3 citation statements)

References 9 publications

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“…Therefore, downsizing the inductor is the prime target while designing a converter. Inductor size is inversely proportional to switching frequency while switching frequency is directly proportional to switching losses [169,[173][174][175]. Therefore, there is a trade-off relation between inductor size and switching losses.…”

Section: Evaluation Of Emerging Switch Technology For Convertersmentioning

confidence: 99%

DC-DC Converter Topologies for Electric Vehicles, Plug-in Hybrid Electric Vehicles and Fast Charging Stations: State of the Art and Future Trends

et al. 2019

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This article reviews the design and evaluation of different DC-DC converter topologies for Battery Electric Vehicles (BEVs) and Plug-in Hybrid Electric Vehicles (PHEVs). The design and evaluation of these converter topologies are presented, analyzed and compared in terms of output power, component count, switching frequency, electromagnetic interference (EMI), losses, effectiveness, reliability and cost. This paper also evaluates the architecture, merits and demerits of converter topologies (AC-DC and DC-DC) for Fast Charging Stations (FCHARs). On the basis of this analysis, it has found that the Multidevice Interleaved DC-DC Bidirectional Converter (MDIBC) is the most suitable topology for high-power BEVs and PHEVs (> 10kW), thanks to its low input current ripples, low output voltage ripples, low electromagnetic interference, bidirectionality, high efficiency and high reliability. In contrast, for low-power electric vehicles (<10 kW), it is tough to recommend a single candidate that is the best in all possible aspects. However, the Sinusoidal Amplitude Converter, the Z-Source DC-DC converter and the boost DC-DC converter with resonant circuit are more suitable for low-power BEVs and PHEVs because of their soft switching, noise-free operation, low switching loss and high efficiency. Finally, this paper explores the opportunity of using wide band gap semiconductors (WBGSs) in DC-DC converters for BEVs, PHEVs and converters for FCHARs. Specifically, the future roadmap of research for WBGSs, modeling of emerging topologies and design techniques of the control system for BEV and PHEV powertrains are also presented in detail, which will certainly help researchers and solution engineers of automotive industries to select the suitable converter topology to achieve the growth of projected power density.

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Section: Evaluation Of Emerging Switch Technology For Convertersmentioning

confidence: 99%

DC-DC Converter Topologies for Electric Vehicles, Plug-in Hybrid Electric Vehicles and Fast Charging Stations: State of the Art and Future Trends

et al. 2019

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“…To achieve high-density power conversion, one of the most difficult challenges relates to the ability to integrate a magnetic component such as a power inductor, which is by far the largest component in a power converter. Power inductor integration is critical to achieving System on Chip (SoC) [4] and System in Package (SiP) [5]. Integrated magnetics is a low-level integration, which combines several magnetic components, such as inductors and transformers, of a converter into a single magnetic structure [6].…”

Section: Introductionmentioning

confidence: 99%

Modeling and Simulation of a Planar Permanent Magnet On-Chip Power Inductor

Abu Qahouq,

Al-Smadi

2024

Modelling

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The on-chip integration of a power inductor together with other power converter components of small sizes and high-saturation currents, while maintaining a desired or high inductance value, is here pursued. The use of soft magnetic cores increases inductance density but results in a reduced saturation current. This article presents a 3D physical model and a magnetic circuit model for an integrated on-chip power inductor (OPI) to double the saturation current using permanent magnet (PM) material. A ~50 nH, 7.5 A spiral permanent magnet on-chip power inductor (PMOI) is here designed, and a 3D physical model is then developed and simulated using the ANSYS®/Maxwell® software package (version 2017.1). The 3D physical model simulation results agree with the presented magnetic circuit model, and show that in the example PMOI design, the addition of the PM increases the saturation current of the OPI from 4 A to 7.5 A, while the size and inductance value remain unchanged.

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“…The demand for small and low-cost electronic package aligned with aggressive maximizing of interconnect density brings us many design challenges on both signal integrity and power integrity [1][2]. Decoupling of devices such as high speed signaling drivers and wireless Radio-Frequency transceivers among different voltage supplies is an important consideration when designing power supply arrangements for a System-on-Chip (SoC) or a Multi-Chip Module (MCM).…”

Section: Introductionmentioning

confidence: 99%

Integrated power supply packaging technique with reduced parasitic inductance for on-die voltage regulator design and application

Huang

2015

2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity

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On-die voltage regulator can improve load regulation, facilitate power management, reduce crosstalk, eliminate transient spikes, and save the board space as well as interconnect pin-counts. This paper presents an integrated circuit package design that provides a low inductance power supply with the capacitive stabilizer for an on-die voltage regulator. A novel 3D design using layered inter-digitated structure is composed of inter-leaved power and ground tracks configured to introduce the negative mutual inductive coupling in between. This design leads to significant reduction of the total parasitic loop inductance, which is verified by electromagnetic simulation using Ansys Q3D. The voltage drop simulated by Spice models is also greatly improved using the proposed layered inter-digitated structure.

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System in Package (SiP) With Reduced Parasitic Inductance for Future Voltage Regulator

Cited by 22 publications

References 9 publications

DC-DC Converter Topologies for Electric Vehicles, Plug-in Hybrid Electric Vehicles and Fast Charging Stations: State of the Art and Future Trends

DC-DC Converter Topologies for Electric Vehicles, Plug-in Hybrid Electric Vehicles and Fast Charging Stations: State of the Art and Future Trends

Modeling and Simulation of a Planar Permanent Magnet On-Chip Power Inductor

Integrated power supply packaging technique with reduced parasitic inductance for on-die voltage regulator design and application

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