System-in-Package, a Combination of Challenges and Solutions

Cauvet, Philippe; Bernard, Serge; Renovell, Michel

doi:10.1109/ets.2007.40

Cited by 7 publications

(2 citation statements)

References 33 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Calculate the slope by the ratio of the hot and cold temperature's variance. Save the slope value into peculiar flash memory [9]. For the offset compensation, it will be stored into another peculiar flash memory.…”

Section: Introductionmentioning

confidence: 99%

Thermal sensor and test technology improving for automotive ICS

Zong

Xiao

Zhu³

2014

2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

View full text Add to dashboard Cite

Analog ICs are widely used in automotive, industrial and consumer area. ICs working environment such as the temperature is the major fact which affect the performance of ICs. The top lead semiconductor companies all on research for developing integrated temperature sensor inside their ICs. This article investigates the method of thermal sensor structure and the test technology improving on automatic test equipment. The high accuracy testing method and system configuration are presented on Intelligent Distribution Controller (IDC) IC. The experiment result shows this method has higher accurate to measure the real chip temperature than the traditional method (achieve ±2°C tolerance). The flash array is using for storing the temperature calibration data.

show abstract

Section: Introductionmentioning

confidence: 99%

Thermal sensor and test technology improving for automotive ICS

Zong

Xiao

Zhu³

2014

2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

View full text Add to dashboard Cite

show abstract

“…Currently, SiP design is mostly done by ad hoc methods and the quality of a design is heavily dependent on the designers' expertise. Tool support specific to SiP design is still inadequate [3], [5]- [9].…”

Section: Introductionmentioning

confidence: 99%

Pad Assignment for Die-Stacking System-in-Package Design

Mak

Lin²,

Chu

et al. 2012

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

View full text Add to dashboard Cite

Abstract-Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so as to facilitate wire bonding, is an important physical design problem for SiP design because the quality of a pad assignment solution affects both the cost and performance of a SiP design. In this paper, we study a pad assignment problem, which prohibits the generation of illegal crossings and aims to minimize the total signal wirelength, for die-stacking SiP design. We first consider the two-die cases and die-stacks with a bridging die, and present a minimum-cost flow based approach to optimally solve them in polynomial time. We then describe an approach, which uses a modified left edge algorithm and an integer linear programming technique, for pyramid die-stacks with no bridging die. Finally, we discuss extensions of the two approaches to handle additional design constraints. Encouraging experimental results are shown to support our approaches.Index Terms-System-in-Package, pad assignment, wire bonding, die-stack.

show abstract