System 901: low K, copper MCM-C packaging

Donohue, P.C.; Page, J.P.; Thiele, Erik S.; Hu, Yung-Haw; Saltzberg, M.A.; Gallo, Sergio Amedeo

doi:10.1109/ectc.1993.346746

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

DOI: 10.1109/ectc.1993.346746

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System 901: low K, copper MCM-C packaging

P.C. Donohue

J.P. Page

Erik S. Thiele

et al.

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System 901: low K, copper MCM-C packaging

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