Synthesis, structure, and magnetic studies on the CoFe2O4–BiFeO3 nanocomposite films with different number of CoFe2O4 layers

Effects of Bismuth Oxide Buffer Layer on BiFeO3 Thin Film

“…(e) and (f) indicate they possessed plate‐like grain structures with extra‐large grain size. In addition, considerable amount of strip‐like and lamellar‐like grains appeared on surface of B*FO/LT‐Bi 2 O 3 , corresponding well to the minor diffraction peaks of β–Bi 2 O 3 and Bi 2 O 2.3 , respectively, in Fig. (f).…”

Improved electric property in SrTiO3–Bi2NiMnO6–SrTiO3 sandwich structural thin films

“…Unfortunately, candidate multiferroic materials are very rare due to the mutual exclusivity of the origins of ferromagnetism and electric polarization, and the ferromagnetism of multiferroic materials needs transition metals with unpaired 3d electrons and unfilled 3d orbital, while ferroelectric polarization needs transition metals with filled 3d orbital. Furthermore, the available multiferroic candidates, such as BiFeO 3 [2][3][4][5], CoFe 2 O 4 -BiFeO 3 [6], Dy-doped BiFeO 3 [7], and BiMnO 3 [8,9], all have serious drawbacks, such as: electric leakage or low temperature for the appearance of multiferroic properties. Therefore, efforts to explore new candidate multiferroic materials are still highly desirable.…”

Nanoparticle-Based Magnetoelectric BaTiO3–CoFe2O4 Thin Film Heterostructures for Voltage Control of Magnetism

“…Previous work successfully demonstrated the manipulation of electric transport properties via controlling the degree of strain at heterostructure oxide phase boundaries for memory devices based on congruent growth of multilayers. , Nanocomposites composed of a mixture of the two components in various configuration schemes using nanoparticles are an attractive route to design room-temperature multiferroics . Several studies report the preparation of composites via traditional solid-state reactions, electrospinning, vacuum-based deposition of composite thin films, and sol–gel routes . Thin film composite structures are particularly suitable and promising for chip-device implementation .…”

“…23 Several studies report the preparation of composites via traditional solid-state reactions, 24 electrospinning, 25 vacuum-based deposition of composite thin films, and sol−gel routes. 26 Thin film composite structures are particularly suitable and promising for chip-device implementation. 27 Vacuum-based deposition methods were found to provide multiferroic thin films with large magnetoelectric coupling, enabling the realization of complex microstructures including epitaxy, texture, or columnar distribution of magnetic nanopillars in a ferroelectric matrix.…”