1997
DOI: 10.1295/polymj.29.290
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Synthesis of Various Polyimides Using Tetrahydrofuran/Methanol as Solvent

Abstract: KEY WORDSMethanol I Poly(amic acid) I Polyimide I Solvent I TetrahydrofuranThe presence of residual solvent in the polyamic acid precursor films affects processing conditions in the fabrication of polyimide films due to the need to remove it from the system. The aprotic solvents typically used in the manufacture of polyamic acids, dimethylacetamide (DMAc) and N-methyl pyrrolidone (NMP), form molecular complexes with polyamic acid making the solvent particularly difficult to remove under ambient conditions. 1 -… Show more

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Cited by 9 publications
(6 citation statements)
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“…To obtain high-molecular-weight PAA it is necessary to dissolve a diamine in THF/MeOH and then to add a dianhydride. 6 We have found that it is possible to dissolve at the most 4 wt% of 4, 4 -oxydianiline in THF/MeOH mixtures with composition ratio ranging from 4:1 to 1:1 (Gaw 6 reported 3 wt% of 3, 3 -oxydianiline in THF/MeOH with composition ratio 4:1).…”
Section: Resultsmentioning
confidence: 90%
“…To obtain high-molecular-weight PAA it is necessary to dissolve a diamine in THF/MeOH and then to add a dianhydride. 6 We have found that it is possible to dissolve at the most 4 wt% of 4, 4 -oxydianiline in THF/MeOH mixtures with composition ratio ranging from 4:1 to 1:1 (Gaw 6 reported 3 wt% of 3, 3 -oxydianiline in THF/MeOH with composition ratio 4:1).…”
Section: Resultsmentioning
confidence: 90%
“…The structure of PMDA-ODA is similar to PI in this work. Additionally, PIs are much more rigid than epoxy due to their much higher density of benzene ring [28] , and the storage modulus of PIs were 3.54.0 GPa [29] . PI can contribute to improvement of tensile and flexural strengths of composites, although the incorporation of PI into the epoxy network can reduce crosslink density to some extent.…”
Section: Mechanical Propertiesmentioning
confidence: 99%
“…A wide range of solvents has been used in synthesis of imides and polyimides but synthesis in aprotic solvents such as DMF (dimethylformamide), DMAc (dimethylacetamide) and NMP (N -methylpyrrolidinone) is the most common method [2,3]. These aprotic solvents tend to complex with the product polyimide and are difficult to remove under ambient conditions [4]. This leads to serious complications in the eventual applications of these materials in composites, adhesives and electronics.…”
Section: Introductionmentioning
confidence: 99%