Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging

Recent Advance in Low‐Dielectric‐Constant Organosilicon Polymers

“…DDSQ‐based epoxy monomer TG‐POSS was developed by Ma et al ., and cured with bisphenol A (BPA) or hexafluoro‐bisphenol A (FBPA). [ 87 ] The obtained resins POSS/BPA and POSS/FBPA both possessed excellent low‐ k properties, ultra‐high thermal stability and excellent hydrophobicity. Specifically, POSS/FBPA displayed a D k of 2.38 and a D f of 0.008 at 1 MHz, which had significant advantages over other epoxy resins.…”

Low viscosity and low temperature curing reactive POSS/epoxy hybrid resin with enhanced toughness and comprehensive thermal performance

“…Furthermore, through chemical modication and physical blending, organic-inorganic hybrid nanocomposites can be synthesized for diverse applications. [37][38][39][40] Reactive POSS can participate in the curing reaction of epoxy resin, achieving dispersion at the molecular level, which enhances its compatibility within the epoxy matrix. This characteristic addresses the drawback of inorganic nanomaterials and non-reactive POSS, which tend to agglomerate in resin matrices.…”

Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins

“…10−12 In addition, with the growth of high-speed and high-frequency communication technology, information processing and transmission should be very fast to ensure the stability and fidelity of electromagnetic signals and to avoid signal propagation delay, attenuation, and crosstalk. Therefore, the substrates and packaging materials should possess low dielectric constant (ε) and dielectric loss tangent (tan δ) 13,14 values in addition to the efficient heat dissipation in order to address these pressing thermal management and electromagnetic wave transmission challenges. However, conventional epoxy resins normally generate an unordered cross-linked network after curing, resulting in severe phonon scattering and thus a low inherent thermal conductivity of merely around 0.2 W/(m•K).…”

“…Consequently, the packing density is also increasing exponentially. − These inevitably cause the substantial increase of heat generation and accumulation, , which would bring adverse effects to the stability, reliability, durability, and service life of components or even burnout or explosion in some extreme circumstances. , Therefore, packaging materials and substrates with efficient heat dissipation are urgently required. − In addition, with the growth of high-speed and high-frequency communication technology, information processing and transmission should be very fast to ensure the stability and fidelity of electromagnetic signals and to avoid signal propagation delay, attenuation, and crosstalk. Therefore, the substrates and packaging materials should possess low dielectric constant (ε) and dielectric loss tangent (tan δ) , values in addition to the efficient heat dissipation in order to address these pressing thermal management and electromagnetic wave transmission challenges.…”

“…According to the Debye equation, the dielectric constant and dielectric loss of polymers can be reduced by introducing chemical bonds or functional groups with low molecular polarizability, increasing the proportion of free volume, or by introducing porous structures to decrease the polar molecule number per unit volume. ,− For instance, by introducing polyhedral oligomeric silsesquioxanes (POSS), a kind of organic–inorganic hybrid material containing a nanoporous structure, researchers have prepared epoxy resins with a low dielectric constant and dielectric loss . However, POSS are usually very expensive.…”