Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder

Meng, Zhichao; Gao, Li-Yin; Liu, Zhiquan

doi:10.1016/j.matchar.2020.110278

Cited by 11 publications

(7 citation statements)

References 31 publications

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“…As no known metal forms an UPD monolayer on Sn in water-based electrolyte, a sustainable SLRR growth of Sn could not be maintained. Instead, Sn coatings with a thickness in the nanometer range were prepared in this work by a galvanic square wave pulse current electrodeposition technique, using an aqueous acidic sulfate plating bath. , A similar filling process (i.e., homogeneous filling within the np-Cu pores) as described above is anticipated using this approach. Preliminary developments involved routines to target thinner coatings by electroplating nanoscale films of Sn in baths with controlled chemistry while containing plain metal precursors and/or different combinations of additives (carriers, levelers, and brighteners) .…”

Section: Sn-coating Of Np-cu Filmsmentioning

confidence: 99%

Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics

et al. 2023

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Conspectus Nanostructured copper-based materials have emerged as a new generation of robust architectures for realizing high-performing and reliable interconnection in modern electronic packaging. As opposed to traditional interconnects, nanostructured materials offer better compliance during the packaging assembly process. Due to the high surface area-to-volume ratio of nanomaterials, they also enable joint formation by sintering through thermal compression at much lower temperatures compared to bulk counterparts. Nanoporous Cu (np-Cu) films have been employed in electronic packaging as materials that facilitate a chip-to-substrate interconnection, realized by a Cu-on-Cu bonding after sintering. In this Account, we discuss the use of self-supported np-Cu films for low-temperature joint formation. The novelty of this work comes from the incorporation of tin (Sn) into the np-Cu structure, thus ensuring lower sintering temperatures with a goal of producing Cu–Sn intermetallic alloy-based joints between two Cu substrates. The incorporation of Sn is done using an all-electrochemical bottom-up approach that involves the conformal coating of fine-structured np-Cu (initially formed by dealloying of Cu–Zn alloys) with a thin layer of Sn. This Account provides insight on existing technologies for using nanostructured films as materials for interconnects as well as the optimization studies for the Sn-coating processes as a new alternative approach. The applicability of the synthesized Cu–Sn nanomaterials for low-temperature joint formation is also discussed. To realize this new approach, the Sn-coating process is administered by a galvanic pulse plating technique, which is optimized to preserve the porosity in the structure with a Cu/Sn atomic ratio that allows for the formation of the Cu6Sn5 intermetallic compound (IMC). Nanomaterials obtained using this approach are subjected to joint formation by sintering at temperatures between 300 and 200 °C under 20 MPa pressure in forming gas atmosphere. Cross-section characterization of the formed joints postsintering reveals densified bonds with minimal porosity that consist predominantly of the Cu3Sn IMC. Furthermore, these joints are less prone to structural inconsistencies compared to existing joints formed using purely np-Cu. The results presented in this Account provide a glimpse into a facile and cost-effective approach for synthesizing nanostructured Cu–Sn films and illustrate their applicability as new interconnect materials.

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Section: Sn-coating Of Np-cu Filmsmentioning

confidence: 99%

Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics

et al. 2023

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“…This indicates that there is an influence of the size of the GO template on the size of the tin phosphate powder produced. This is due to the theory that the template can control the shape and size of the powder (Meng et al, 2020b).…”

Section: Effect Of Milling Time and Addition Of Graphite On The Morph...mentioning

confidence: 99%

“…The methods usually used are hydrothermal, polymers, organo-metal precursor synthesis, sonication, microwave, and surfactant-mediated methods (Bhagwat et al, 2015). Synthesis using templates is the most promising approach because it can control the shape and size of nanowires by changing the pores in the template (Meng et al, 2020a). Therefore, milling the template can affect the size of the resulting powder.…”

Section: Introductionmentioning

confidence: 99%

Effect of Milling Time and Addition of Graphite on the Morphological Structure of Tin Phosphate Powder Using the Graphine Oxide Template Method for Electrolyte Applications

Nandito,

Arnoldus,

Alfarizi

et al. 2023

JOSR

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Tin phosphate can be used for electrolyte applications. The solid electrolyte industry has experienced significant growth in recent years. In 2020, the market size of the solid electrolyte industry was estimated at $17.8 million and is expected to reach $56.6 million by 2030 at a CAGR of 12.1% from 2021 to 2030. The growth of the solid electrolyte industry is driven by the increasing demand for batteries. Solid-state batteries are becoming a promising alternative to conventional lithium-ion batteries. This research produces tin phosphate nanoparticles through the synthesis of tin phosphate/GO with a modification of the Hummers reaction, using the GO template method which is used to control the morphology and crystal structure of the synthesized material, and calcined to remove GO and produce tin phosphate powder. The research results show that graphite milling time influences the size of the tin phosphate powder produced, and the size of the Graphene Oxide (GO) template also influences the size of the tin phosphate powder. Grinding time also affects the weight of the powder before and after calcination, as well as the amount of GO and tin phosphate produced. The graphite addition ratio also had a significant effect on the weight of the tin phosphate/GO samples before and after calcination. The ratio of adding 2 grams of graphite to 1 gram of tin produces an optimal weight of tin phosphate after calcination, indicating the effectiveness of using GO as a tin growth template. In addition, XRD analysis showed the identification of three dominant compound phases in the resulting powder, namely potassium ditin (IV) tris(phosphate(V)) (KO12P3Sn2), tin phosphate (SnP2O7), and potassium ferrate (FeKO2).

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“…Many interconnection techniques have emerged [3,[8][9][10][11][12][13][14], among which the nanosoldering has shown great promise as it can use a nanosolder as filler material to accomplish an interconnection without detrimental effects on the original nano-objects [8,15]. Some kinds of nanoscale solders have been developed to meet the demand for nanosoldering applications, such as Sn, SnCu, SnAu, SnIn, SnCuAg, SnCuMn nanosolders [15][16][17][18][19][20], etc. In this technique, nanosolders melt through reflow process and then wet nanomaterials to be joined to form electrical contacts, thereby accomplishing the assembly of functional nanodevices [8,15,17].…”

Section: Introductionmentioning

confidence: 99%

Rapid in situ wetting measurement for nanosolder by electron beam irradiation

Zhang

2023

Science and Technology of Welding and Joining

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In nanosoldering, the wettability of nanosolder is a key factor to gauge the contacts' firmness.Here, a novel in situ wetting measurement method by using electron beam irradiation in transmission electron microscopy has been proposed, which has the crucial advantages of dynamically observing the wetting process between nanosolder and nanomaterial to be soldered, rapidly measuring the contact angle, and greatly avoiding the complex procedures in traditional method. The experimental tests show that the contact angle of a reflowed 97Sn3Cu nanosolder drop on a WO 3 nanowire obtained by the new method is consistent with that obtained by the traditional method. This novel wetting measurement method is aimed at promoting the application of nanosolders in nanosoldering.

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Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder

Cited by 11 publications

References 31 publications

Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics

Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics

Effect of Milling Time and Addition of Graphite on the Morphological Structure of Tin Phosphate Powder Using the Graphine Oxide Template Method for Electrolyte Applications

Rapid in situ wetting measurement for nanosolder by electron beam irradiation

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