Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Zhan, Haijiao; Guo, Jiayu; Shen, Jiali; Wang, Xiaorong; Fan, Zhonghua; Guo, Bing; Liu, Wei; Shen, Hangyan

doi:10.1007/s11664-019-06957-6

Cited by 9 publications

(5 citation statements)

References 44 publications

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“…Their relevance spans from the inception of printed circuit boards to the emergence of flexible circuits in recent years [6]. Silver, characterized by its status as the pure element boasting optimal electrical conductivity at room temperature, possesses attributes such as exceptional electrical conductivity, robust resistance to oxidation in atmospheric conditions, and stable optical and chemical characteristics, contingent upon its size, composition, and morphology [7]. Consequently, silver finds extensive utility in the realm of printed electronic materials, ranging from low-cost thin film switches, solar cells, electroluminescent devices, sensors, conductive adhesives, and conductive films to circuits, thin film transistors, and radio frequency identification (RFID) tags [8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

High electrical conductivity and bending resistance of Ag NPs/Ag flakes composite silver paste are achieved by sintering Ag NPs

Quan,

Gan,

et al. 2024

Mater. Res. Express

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The investigation of conductive silver pastes and inks has witnessed extensive research within the domain of printed electronics in recent years, primarily owing to the exceptional electrical conductivity and steadfastness intrinsic to silver. This paper introduces an approach for the fabrication of stable, cost-effective, and low-resistance conductive silver paste tailored for flexible printed circuits. This method facilitates the solidification of the conductive silver paste into a highly conductive silver film at a curing temperature of 250℃. In the process of preparing the conductive silver paste, Ag Flakes is subject to modification through the incorporation of Ag NPs, which are subsequently sintered at a low temperature curing setting. The sintering of Ag NPs serves to establish connections between adjacent particles of Ag Flakes within the paste, thereby enhancing the conductivity and flexibility of the resulting conductive printed silver film. When the ratio of Ag NPs to Ag Flakes is maintained at 10:90, the volume resistivity of the Ag NPS-modified film registers at 2.7×10-5 Ω.cm. This demonstrates a substantial 53.45% reduction in the volume resistivity of the conductive printed silver film modified with Ag NPs, compared to its Ag NPs-absent counterpart. Post 200 cyclic bending tests, it becomes evident that the resistance change rate in the Ag NPs-modified conductive printed silver film is a mere 12.5%, whereas the Ag NPs-modified silver film lacking Ag NPs displays a resistance change rate of 21.5%. This discrepancy underscores the capacity of Ag NPs-modified Ag Flakes to fortify the bending resistance of the conductive printed silver film. Comprehensive data analysis substantiates that the improvements in electrical conductivity and bending resistance can be attributed to the superior bridging facilitated by the sintering process on the surface of the Ag NPs-modified Ag Flakes.

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Section: Introductionmentioning

confidence: 99%

High electrical conductivity and bending resistance of Ag NPs/Ag flakes composite silver paste are achieved by sintering Ag NPs

Quan,

Gan,

et al. 2024

Mater. Res. Express

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“…Low-temperature-hardened Ag paste has a curing temperature of 100 °C–200 °C and is mainly used as electrodes for flexible or stretchable substrates such as polyethylene terephthalate (PET). The binder used to manufacture the paste remains intact, and the Ag particles stick together (contact) and conduct [ 21 , 22 , 23 ]. On the other hand, high-temperature-sintered Ag paste, which is mainly used on substrates such as wafers or tempered glass, achieves conductivity by sintering Ag particles after thermally decomposing the binder at high temperatures.…”

Section: Introductionmentioning

confidence: 99%

Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

Nam,

Shin,

Koo

et al. 2024

Materials

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This study compares the characteristics and low-temperature curing properties of pastes prepared from silver (Ag) powders synthesized by either wet powder (WP) or dry powder (DP) processing. The WP synthesis of electrode particles has the advantage of controlling the average particle size and particle size distribution but the disadvantage of producing low-purity, crystalline particles because they are synthesized through chemical reduction at less than 100 °C. Conversely, the DP synthesis of electrode particles has the advantage of producing pure, highly crystalline particles (due to synthesis at high temperatures) but the disadvantage of a high processing cost. WP and DP were used to manufacture pastes for low-temperature curing, and the physical properties of the pastes and the electrode characteristics after low-temperature curing were compared between powder types. Shear stress as a function of the shear rate shows that the WP paste is a plastic fluid, whereas the DP paste is a pseudoplastic fluid, closer to a Newtonian fluid. Screen printing the Ag pastes and curing for 30 min at 130 °C produces a nonconductive WP paste, whereas it produces a DP paste with a conductivity of 61 mΩ/sq, indicating that the highly crystalline DP paste is advantageous for low-temperature curing.

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“…Silver and gold metals boast the unique and excellent properties of corrosion resistance, stability, ductility, conductivity, and thermal conductivity [1,2] and play a significant role in high-tech territory such as electronics, communication, aerospace and optoelectronics [3,4]. In the recovery of silver or gold from minerals, copper anode slime and lead anode slime, it is inevitable to form the Ag-Au system, which always contains Cu and Sb metals [5,6], because the physical and chemical properties of Ag, Au, Cu and Sb metals are similar.…”

Section: Introductionmentioning

confidence: 99%

Activity Calculation and Vacuum Separation Theoretical Research concerning Ag–Cu, Ag–Sb and Cu–Sb Binary Alloys

Li,

Tian,

Kong

et al. 2024

Metals

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The Ag–Cu–Sb system is a key component of lead anode slime and boasts an exceptionally high economic recovery value. In this work, six models, including the Molecular Interaction Volume Model (MIVM), Modified Molecular Interaction Volume Model (M-MIVM), Wilson equation, Miedema model, Regular Solution Model (RSE) and Sub-Regular Solution Model (SRSE), are used to calculate the predicted values of the activity and its deviations with experimental data for binary alloys in the Ag–Cu–Sb system for the first time. The result reveals that the overall means of the average relative deviation and average standard deviation of the M-MIVM are 0.01501 and 3.97278%, respectively, which are about two to six times smaller than those of the other five models, indicating the stability and reliability of the M-MIVM. In the meantime, the predicted data of the Cu–Ag binary alloy at 1423 K, Sb–Ag binary alloy at 1250 K and Sb–Cu binary alloy at 1375 K calculated from the M-MIVM are more reliable and pass the Herington test. Then, the separation coefficient–composition (β–x), temperature–composition (T–x–y) and pressure–composition (P–x–y) of the Cu–Ag, Sb–Ag and Sb–Cu binary alloys are plotted based on the M-MIVM and vacuum theories, showing that the Cu–Ag binary alloy is relatively difficult to separate and that high temperatures or high copper contents are detrimental to obtaining high-purity silver. Meanwhile, theoretical data of the T–x–y diagram are consistent with the available experimental data. These results can guide vacuum separation experiments and industrial production concerning Ag–Cu, Ag–Sb and Cu–Sb binary alloys.

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Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Cited by 9 publications

References 44 publications

High electrical conductivity and bending resistance of Ag NPs/Ag flakes composite silver paste are achieved by sintering Ag NPs

High electrical conductivity and bending resistance of Ag NPs/Ag flakes composite silver paste are achieved by sintering Ag NPs

Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

Activity Calculation and Vacuum Separation Theoretical Research concerning Ag–Cu, Ag–Sb and Cu–Sb Binary Alloys

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