Synthesis of nanoparticles composed of silver and copper for metal–metal bonding

Abstract

A metal–metal bonding technique is described that uses nanoparticles composed of silver and copper. Colloid solutions of nanoparticles with an Ag content of 0–100 mol% were prepared by simultaneous reduction of Ag+ and Cu2+ using hydrazine with polyvinylpyrrolidone and citric acid as stabilisers. The nanoparticles ranged in size from 34 to 149 nm depending on the Ag content. Copper discs were strongly bonded at 400°C for 5 min under 1.2 MPa pressure in hydrogen gas; the maximum shear strength was as high as 23.9 MPa. The dependence of shear strength on the Ag content was explained by a mismatch between the d-spacings of Cu metal and Ag metal.

Strategies to synthesise copper oxide nanoparticles and their bio applications – a review

“…This synthesis is a fundamental strategy that proceeds in three parts: Creation, Enhancement, The Implosive disintegration of the attained micro-cavities. The procedure comprises the usage of ultrasound while the processing of outcome [8,29,30]. …”

Multi-layered micro-patterns co-printed with Ag@CuO nano-ink for flexible devices

“…With the rapid development of flexible electronics, the key process technologies of printed micro-patterns have become cost-effective [5][6][7] and efficient [8][9][10], with low-pollution [3] and lowwaste [11]. Currently, most micro-patterns are printed using gold or silver, both of which have unique advantages, such as good conductivity and oxidation resistance [6,[12][13][14]. Nevertheless, gold (Au) and silver are precious metals and thus costly.…”