“…41 Its electronic and thermoelectric properties, along with its layered structure, can enable the construction of chip-scale thermoelectric coolers and generators. 10 Bi 2 Te 3 is also used for bulk thermoelectric devices, and processing procedures used to optimize performance include sintering nanoparticles to increase the grain boundary density 42 and introducing nanoscale scattering sites by adding dopants, [43][44][45] intercalants, 16,32,[46][47][48][49] heterointerfaces, 10 and nanoinclusions. 50 During the fabrication of devices, it is common to solder conductive contacts containing metals such as Al, Sn, and Cu onto Bi 2 Te 3 .…”