Synthesis of Cu/CNTs nanocomposites for antimicrobial activity

Abstract

We report a facile method for the synthesis of Cu/multi-walled carbon nanotubes (CNTs) composite powder employing a chemical reduction method followed by high-energy ball milling involving the use of sodium borohydride as a reducing agent and copper sulphate as the precursor material. Control of oxidation of Cu nanoparticles (CuNPs) is a key factor in the synthesis of Cu/CNTs nanocomposites via chemical reduction methods and other methods. To overcome this problem we have applied a new facile rapid synthesis method using a combination of molecular-level mixing followed by high-energy ball milling to produce mostly CuNPs. X-ray diffraction results indicated the presence of mostly CuNPs in composite powder. Scanning electron microscopy and high resolution transmission electron microscopy (HRTEM) was used to ascertain the dispersion of CNTs in Cu matrix. Most of the CuNPs synthesized in the present work had a particle size ranging from 20–50 nm as revealed by HRTEM characterization. Moreover, the CNTs were also found to be homogeneously dispersed in Cu matrix. The Cu/CNTs nanocomposite has a wide range of applications from fuel cells to electronic chip components. In the present work we have investigated the antimicrobial activity of Cu powder and varying concentrations of Cu/CNTs nanocomposite against gram negative Providencia sp. bacteria, and gram positive Bacillus sp. bacteria. These findings suggest that Cu/CNTs nanocomposite can be used in antibacterial controlling systems and as an effective growth inhibitor in the case of various microorganisms.

Preparation and properties of 3D interconnected CNTs/Cu composites

“…Shukla et al [13] investigated the tensile strength of CNTs/Cu composites prepared via mechanical alloying and hot pressing sintering, the results showed that the tensile strength of CNTs/Cu composites reached 330 MPa. However, the above-stated method cannot be achieved the uniform dispersion of CNTs in the Cu matrix and the good interfacial bonding between the CNTs and Cu, which will result in the failure of realization of CNTs as a reinforcement [14][15][16]. Therefore, it is necessary to investigate a novel method to disperse CNTs uniformly in the Cu matrix, and to improve the interfacial bonding between CNTs and Cu matrix.…”

In Situ Synthesis of CNTs/Cu Nanocomposites and the Electronic Transport Properties

“…Several methods have been suggested to improve the properties of bulk CNTs’ materials by chemical or metallic doping. Numbers of metallic elements such as Cu, Cr, Au, Ag, or Al have been applied to combine with CNTs, among them Cu seems to be more excellent due to its lower cost, higher electric conductivity, better thermal conductivity, and antimicrobial activity . In recent years, CNTs/Cu nanocomposites have been successfully fabricated by chemical reduction method, spark plasma sintering (SPS), molecular‐level mixing, and electroplating method .…”

“…Numbers of metallic elements such as Cu, Cr, Au, Ag, or Al have been applied to combine with CNTs, among them Cu seems to be more excellent due to its lower cost, higher electric conductivity, better thermal conductivity, and antimicrobial activity. [13,14] In recent years, CNTs/Cu nanocomposites have been successfully fabricated by chemical reduction method, [15] spark plasma sintering (SPS), [16] molecular-level mixing, [17] and electroplating method. [18] Among them, the CNTs/Cu nanocomposite fabricated by an electroplating showed high electronic conductivity as %4.7 Â 10 5 S cm À1 (bulk Cu: 5.8 Â 10 5 S cm À1 , pristine CNT: %10 2 S cm À1 ).…”

Flexible antibacterial Al–Cu–N films

“…For this purpose the films containing silver Ag [1][2][3][4][5][6][7][8][9][10][11][12][13][14] and copper Cu [15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33] were developed. It was found that both kinds of films efficiently kill bacteria if the content of Ag or Cu is higher than a minimum value, which usually is of about 10 at.% or greater.…”