“…Their results indicate that the silver matrix composite, due to the homogeneous dispersion of Ag-doped graphene, has good comprehensive properties at 0.5 wt% Ag-doped graphene, in which electrical conductivity reaches up to 98.62% IACS. Thanks to the mentioned properties, silver matrix composites have found application in the electronic packing industry as contact materials in electronics and electrical brushes [14][15][16].…”
The paper presents the results of a study of the microstructure and selected properties of silver-based composites reinforced with TiO2 nanoparticles, produced by the powder metallurgy method. Pure silver powders were mixed with TiO2 reinforcement (5 and 10 wt%) and 5 mm steel balls (100Cr6) for 270 min in a Turbula T2F mixer to produce a homogeneous mixture. The composites were made in a rigid die with a single-action compaction press under a pressure of 400 MPa and 500 MPa and then sintered under nitrogen atmosphere at 900 °C. Additionally, to improve the density and mechanical properties of the obtained sinters, double pressing and double sintering operations were conducted. As a result, compacts with a density of 90–94% were obtained. The microstructure of the sintered compacts consists of uniform grains, and the TiO2 reinforcement phase particles are located on the grain boundaries. There were no discontinuities at the Ag–TiO2 contact boundary, which was confirmed by SEM and TEM analysis. The use of a higher pressure had a positive effect on the hardness and flexural strength of the tested materials. It was found that the composites with 5 wt% TiO2 pressed under 500 MPa are characterized by the highest level of mechanical properties. The hardness of these composites is 57 HB, while the flexural strength is 163 MPa.
“…Their results indicate that the silver matrix composite, due to the homogeneous dispersion of Ag-doped graphene, has good comprehensive properties at 0.5 wt% Ag-doped graphene, in which electrical conductivity reaches up to 98.62% IACS. Thanks to the mentioned properties, silver matrix composites have found application in the electronic packing industry as contact materials in electronics and electrical brushes [14][15][16].…”
The paper presents the results of a study of the microstructure and selected properties of silver-based composites reinforced with TiO2 nanoparticles, produced by the powder metallurgy method. Pure silver powders were mixed with TiO2 reinforcement (5 and 10 wt%) and 5 mm steel balls (100Cr6) for 270 min in a Turbula T2F mixer to produce a homogeneous mixture. The composites were made in a rigid die with a single-action compaction press under a pressure of 400 MPa and 500 MPa and then sintered under nitrogen atmosphere at 900 °C. Additionally, to improve the density and mechanical properties of the obtained sinters, double pressing and double sintering operations were conducted. As a result, compacts with a density of 90–94% were obtained. The microstructure of the sintered compacts consists of uniform grains, and the TiO2 reinforcement phase particles are located on the grain boundaries. There were no discontinuities at the Ag–TiO2 contact boundary, which was confirmed by SEM and TEM analysis. The use of a higher pressure had a positive effect on the hardness and flexural strength of the tested materials. It was found that the composites with 5 wt% TiO2 pressed under 500 MPa are characterized by the highest level of mechanical properties. The hardness of these composites is 57 HB, while the flexural strength is 163 MPa.
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