Synthesis of citrate-capped copper nanoparticles: A low temperature sintering approach for the fabrication of oxidation stable flexible conductive film

Copper inks for printed electronics: a review

“…Thus, to realize sintering at lower temperatures (<120 °C) and solve the oxidation problem, copper-based inks with different formulations have been developed in previous research works. [74][75][76][77][78][79] The different types of ink materials can be classified as follows: copper particle ink, copper nanowire ink, copper precursor ink, and copper mixed ink. This section discusses different formulations of copper inks and their performance.…”

“…At present, the mainstream solution to increase the interaction between molecules and cover the copper particles to form a protective layer is to add capping agents of organic substances, such as polyvinylpyrrolidone (PVP), 54,56,[90][91][92] oleic acid, 93 thiol, 94,95 oleamine, 96 cellulose 97,98 and acid. 76,99 The capping agents can be effectively desorbed during the subsequent sintering process, as shown in Fig. 2a.…”

Metallisation of Textiles and Protection of Conductive Layers: An Overview of Application Techniques

“…On the other hand, high Ag loading is required for metal-based inks (more than 20 wt %) [41], so the main challenge is to find less expensive, but, at the same time, a highly-efficient conductive metal to replace the Ag (nano)particles. Aluminum (Al) [32] and Cu [34,[42][43][44] have been proposed as alternatives to Ag, but they are not stable against oxidation, due to the formation of an insulating oxide layer that can affect the final conductivity of the ink greatly [32]. The advent of a new class of materials called MXenes has also been widening their application in printed electronics, overcoming the drawbacks of conductive inks such as poor conductivity [45].…”

Copper nanoparticles induced, trimesic acid grafted cellulose–an effective, non-hazardous processing approach for multifunctional textile with low chemical induction

“…Copper nanoparticles were synthesized through the wet processing method as described in the literature with modification (Sarwar et al 2021). Briefly, 15 ml of 0.1 M copper salt solution was taken in a break and heated up to 80 °C with continuous stirring at 800 RPM.…”

“…The reaction equation of the SHP reduction is presented in Eq. 1 (Sarwar et al 2021). As soon as copper nuclei formed, citric acid (present in solution) radially absorbed in the surface of Cu-NPs hence provide encapsulation (Deng et al 2013).…”