Synthesis of a polydimethylsiloxane-block-hydroxyl grafted acrylate prepolymer copolymer to improve the adhesion between silicone rubber and polyurethane by induced surface reconstruction

A novel alkali-soluble photosensitive polysiloxane urethane acrylate (APSUA) was synthesized via reacting bifunctional isocyanate with three kinds of hydroxyl group respectively, from hydroxyl silicone oil, dimethylol propionic acid (DMPA), and a compound which also has acrylate groups. The compound was prepared via reacting acrylic acid with N,N,N 0 ,N 0 -tetraglycidyl -4,4 0 -diamino diphenyl methane (AG-80). The optimum temperature for the synthesis reaction of APSUA was found to be 50 C. The structure of the oligomer was characterized by IR, 1 HNMR, and GPC. The numberaverage molecular weight of the APSUA was 7795. The APSUA possesses excellent compatibility with most of acrylate monomers. The effect of concentration of photoinitiator and monomers on the photopolymerization kinetics of the oligomer APSUA was investigated by realtime infrared spectroscopy (RT-IR). The results show that APSUA can well photopolymerize under UV-irradiation. The optimal concentration of photoinitiator (Darocur 1173) was determined as 0.1 wt %. The system of APSUA with DPGDA monomer has higher polymerization rate (0.0521 s À1) and higher double bond conversion (93.2%), respectively. The APSUA system with acrylate monomers can form regular image under UV-irradiation through a patterned mask. The cured coating film of the APSUA system possesses excellent flexibility, toughness and heat resistance. The APSUA system can dissolve in 1% sodium carbonate solution easily and completely.

Section: Ir Of Apsuamentioning

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Section: Introductionmentioning

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Section: Introductionmentioning

confidence: 99%

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confidence: 99%

“…1 HNMR spectra were recorded on an AV600MHz (Bruker, USA) spectrometer, using CDCl 3 as the solvent and tetramethylsilane as an internal standard.…”

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confidence: 99%

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Synthesis and characterization of alkali‐soluble photosensitive polysiloxane urethane acrylate

Sun

Liao

Zhang

et al. 2011

Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask

Sun

Jiang

2010

ABSTRACT:The photosensitive and physical and mechanical properties of a novel polysiloxane urethane acrylate (PSUA) for solder mask were investigated using realtime FTIR, DMTA and TGA. It is noted that PSUA showed a notable photosensitivity and a good compatibility with the acrylic monomers and resins. PSUA cured film exhibited excellent thermal property, tensile strength and toughness, and chemical resistance. The decomposition temperature of PSUA was 402 C. Thermal weight losses of pure PSUA cured film at 300 C were only 5%.Elongation percentage of PSUA cured film was up to 59%. PSUA resin can be used for solder mask materials for printed circuit. Technology performances of photosensitive imaging flexible solder mask containing PSUA answers operating requirements of the solder masker for printing circuit board.

Synthesis and characterization of hydroxypropyl terminated polydimethylsiloxane‐polyurethane copolymers

Bai

Lin

Pang

et al. 2013

Polyurethane (PU) block copolymers were synthesized using prepared hydroxypropyl terminated polydimethylsiloxane (HTPDMS MW 990) and polyether diols (N-210) as soft segment with 4,4 0 -diphenylmethane diisocyanate (MDI) and 1,4-butanediol. This low molecular weight polydimethylsiloxanes (PDMS) containing hydroxypropyl end-groups displayed better compatibility with PU than common PDMS. In this article, we illustrate its synthesis routes and confirmed the proposed molecular structures using NMR and infrared radiation (IR). We varied the contents of HTPDMS and N-210 in soft segments 20 : 80, 40 : 60, 60 : 40, 80 : 20, and 100 : 0) to synthesize a series of PDMS-PU copolymer. IR spectroscopy showed the assignment characteristic groups of each peak in copolymers and confirmed that the desired HTPDMS-PU copolymers have been prepared. The different thermal, dynamic mechanical and surface properties of the copolymers were compared by thermogravimetry, DMA, contact angle and solvent resistance.