Synthesis of a 316L stainless steel-copper composite by laser melting

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

“…ODS 316 L SS [ 193 ] was also produced by depositing an ethanol-based ink containing Al 13 nanoclusters (NCs) onto 316 L SS powder and then processed by laser. Moreover, a 316 L SS—Cu MMC was fabricated to enhance effective thermal conductivity compared to 316 L SS by using a jettable Cu ink and emulating the hybrid LPBF-Inkjet method [ 48 ].…”

“…Due to their exceptional electrical and thermal properties, Cu and W are the primary materials of choice as interconnects, electrodes, and thermal spreaders [ 42 , 43 , 44 , 45 , 46 , 47 , 48 , 49 , 50 ]. Such applications necessitate the deposition of thin films, thick coatings, and patterning, as well as the doping of Cu or W nanomaterials into other metal matrices to produce functional composite alloys and 3D structures of Cu and W. For instance, patterned thin films of Cu/W can be utilized as gate electrodes in thin-film transistors [ 51 , 52 , 53 , 54 , 55 ] or as metal interconnects in semiconductor devices when applied as thick films [ 43 ].…”

“…Such applications necessitate the deposition of thin films, thick coatings, and patterning, as well as the doping of Cu or W nanomaterials into other metal matrices to produce functional composite alloys and 3D structures of Cu and W. For instance, patterned thin films of Cu/W can be utilized as gate electrodes in thin-film transistors [ 51 , 52 , 53 , 54 , 55 ] or as metal interconnects in semiconductor devices when applied as thick films [ 43 ]. Moreover, free-standing 3D structures can serve as current collectors [ 56 ] or heat sinks [ 57 ], while doping Cu or W phases into a primary metal matrix can enhance thermal properties [ 47 , 48 ]. Several additive and subtractive manufacturing methods, such as photolithography, plasma etching, wet etching, dry reactive etching, ion beam lithography, machining, physical vapor deposition, chemical vapor deposition, powder metallurgy, laser melting, and combinations of these methods have been used to fabricate these two transition metals or dope these materials into another material [ 38 , 48 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 ].…”

“…Moreover, free-standing 3D structures can serve as current collectors [ 56 ] or heat sinks [ 57 ], while doping Cu or W phases into a primary metal matrix can enhance thermal properties [ 47 , 48 ]. Several additive and subtractive manufacturing methods, such as photolithography, plasma etching, wet etching, dry reactive etching, ion beam lithography, machining, physical vapor deposition, chemical vapor deposition, powder metallurgy, laser melting, and combinations of these methods have been used to fabricate these two transition metals or dope these materials into another material [ 38 , 48 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 ].…”