2005
DOI: 10.1002/pi.1931
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Synthesis, characterization and properties of organoclay‐modified polyurethane/epoxy interpenetrating polymer network nanocomposites

Abstract: organoclay‐modified polyurethane/epoxy interpenetrating network nanocomposites (oM‐PU/EP nanocomposites) were prepared by adding organophilic montmorillonite (oMMT) to interpenetrating polymer networks (IPNs) of polyurethane and epoxy resin (PU/EP) which had been prepared by a sequential polymerization technique. Wide‐angle X‐ray diffraction (WAXD) and transmission electronic microscopy (TEM) analysis showed that the interpenetrating process of PU and EP improved the exfoliation and dispersion degree of oMMT. … Show more

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Cited by 32 publications
(19 citation statements)
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References 23 publications
(24 reference statements)
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“…The rigidity and the heat stability of PU polymer will be obviously improved if PU is reclaimed by PMMA via interpenetrating a polymer network (IPN) (8). Due to fluent properties and simple synthesis of PU, it is one of the most widely used polymer components in the synthesis of IPNs (9,10).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The rigidity and the heat stability of PU polymer will be obviously improved if PU is reclaimed by PMMA via interpenetrating a polymer network (IPN) (8). Due to fluent properties and simple synthesis of PU, it is one of the most widely used polymer components in the synthesis of IPNs (9,10).…”
Section: Introductionmentioning
confidence: 99%
“…Several studies have been conducted on the application and synthesis of IPNs. Many researchers have studied the PU IPNs to improve PU properties (10). Recently, Suthar et al have studied a series of IPNs from castor oil based on PU with acrylic.…”
Section: Introductionmentioning
confidence: 99%
“…It is simple, has a significant effect, but the resulting viscosity is too high and the electrical conductivity is too low. In the chemical method, epoxy toughened by an interpenetrating polymer network (such as modified polyurethane), curing agent with flexible chain segments (such as curing agent mixed with carboxyl‐terminated hyperbranched polyester and methyltetrahydrophthalic anhydride), reactive flexible molecules, etc., often have a good effect on the electrical, mechanical and thermal properties of ECAs. In addition, reducing the storage modulus is also always used to improve the flexibility and toughness of ECAs which can reduce the thermal stress produced during the soldering process and decrease the risk of cracking and delamination of electronic packaging …”
Section: Introductionmentioning
confidence: 99%
“…Therefore, in this work, we focused on the effects of oM and polyurethane (PU) on the wear behavior and thermal properties of EP/PU nanocomposites on the basis of our previous work. 7,25 A pin-on-disc rig was used to test friction and wear loss, and morphologies of wear face were studied by scanning electron microscopy (SEM) observations. Thermal behavior of these nanocomposites was also investigated by thermogravimeric analysis (TGA).…”
Section: Introductionmentioning
confidence: 99%