Synthesis andI–Vproperties of aligned copper nanowires

Abstract

This paper reports the synthesis of well-aligned copper nanowires using an electrochemical deposition template technique. The electrical properties of copper nanowire arrays synthesized within vertical pores of alumina template were measured using a current-sensing atomic force microscope (AFM), with bias voltage applied between the AFM tip and the gold back-electrode. Nonlinear current-voltage (I-V) characteristics of copper nanowire arrays are observed; this is attributed to the impurities near the wire-lead contact region. These vertical copper nanowire arrays are suitable for use in fabricating nanoelectronic devices.

Fabrication and electrical characterization of highly ordered copper nanowires

“…Similar non-linear I-V behaviour has been observed for silver (Mehrez and Guo 2004), and gold (Wildoer et al 1998) nanowires; such a behavior is required for functional electronic devices (Itakura et al 1999). Figure 8b shows a quasi-plateau formation in region II, also observed by Cao et al (2006), and the sharp increase and decrease in current noticed for the forward as well as the reverse bias correspond, respectively, to around ?8.8 V and -9.4 V. For the three segments, the voltage, current, resistance and conductance are shown in Table 1. Figure 9 stands for the impedance spectroscopy of the nanowires, embedded in AAM as host, at frequencies 0.2-1.0 MHz.…”

Influence of the electrical parameters on the fabrication of copper nanowires into anodic alumina templates

“…Fig. 10a, which is relative to an array deposited at À0.6 V(SCE) evidences that template dissolution does not alter the alignment between NWs, which are firmly hammered in the thin gold layer visible at the bottom [13]. Moreover, an acceptably uniform length is visible.…”

“…This was confirmed by X-ray diffractograms revealing a polycrystalline structure of the deposited metal (see Fig. 3) [6,13,31,38]. Identification of peaks, which are relative to the cubic structure of copper, was performed by comparison with the ICDD data-base, card no.…”

“…Besides, substitution of aluminium with copper for interconnections in integrated circuits and in high-performance multichip modules constitutes a great improvement in the field of electronics [13,14]. This has been possible, thank to a better control in the electrodeposition process of metallic Cu; with this aim, optimization of bath composition was investigated, in order both to increase its throwing power and to obtain very uniform thickness of the metallic deposit [15,16].…”

Fabrication and Characterization of Copper Nanowires

“…I-V properties of aligned copper nanowires have been studied using a current-sensing AFM (Cao et al, 2006). Electronic transport through nanocontacts has been an active research area.…”