2006
DOI: 10.1002/app.24347
|View full text |Cite
|
Sign up to set email alerts
|

Synthesis and characterization of fluorine and nitrile containing polyimides

Abstract: A series of polyimides were synthesized from new diamine, Bis [4,4Ј-amino-5,5Ј trifluoromethyl phenoxy-(hexafluoro isopropylidine) phenoxy phenyl] benzonitrile [BATFB] and various aromatic tetracarboxylic anhydrides by thermal and chemical imidization routes. The BATFB was synthesized in two steps by nucleophilic displacement reaction of 2,6-dichloro benzonitrile, 4,4Ј-(hexafluoro isopropylidine) diphenol and 2-amino-5-fluoro benzotrifluoride in the presence of anhydrous potassium carbonate in N,NЈ-dimethyl a… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2008
2008
2021
2021

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 14 publications
0
2
0
Order By: Relevance
“…Due to these properties they have been extensively used in aerospace, microelectronic, aviation, defense and electronic packaging industries (Wilson et al 1990;Cassidy 1980;Mallakpour and Kowsari 2005;Guo et al 2007a;Faghihi and Gholizadeh 2010;Raju and Alam 2006). However, one of the problems with most polyimides is their poor processability, high dielectric constant, high glass transition and limited solubility in common organic solvents.…”
Section: Introductionmentioning
confidence: 97%
“…Due to these properties they have been extensively used in aerospace, microelectronic, aviation, defense and electronic packaging industries (Wilson et al 1990;Cassidy 1980;Mallakpour and Kowsari 2005;Guo et al 2007a;Faghihi and Gholizadeh 2010;Raju and Alam 2006). However, one of the problems with most polyimides is their poor processability, high dielectric constant, high glass transition and limited solubility in common organic solvents.…”
Section: Introductionmentioning
confidence: 97%
“…Addition polyimides, such as 5‐norbornene‐2,3‐dicarboximide (nadimide), maleimide and ethynyl terminated imide resins are a leading class of thermosetting polyimides and have received attention because of their excellent thermal stability, good chemical resistance, good mechanical and electrical properties. 1–9 Since early1970's these resins have been extensively investigated as matrix resins for advance fiber reinforced composites, adhesives and in multilayer circuit boards in electronic industry. The drawback of these resins is their brittleness due to high crosslink density.…”
Section: Introductionmentioning
confidence: 99%