Synthesis and characterization of a novel high durability alloy microcapsule for thermal energy storage

Zhu, Sixian; Zou, Deqiu; Bao, Jiaming; Ma, Qun; Wang, Yinshuang; Yun-ping, HU

doi:10.1016/j.solmat.2021.111262

Cited by 28 publications

(2 citation statements)

References 43 publications

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“…[21] Currently, only a few microencapsulation technologies and formstable composite technologies are suitable for high-temperature PCM. Microencapsulation technologies primarily rely on in situ shell formation, [10,12,22,23] silicon-based precursor shells, [8,[24][25][26] and sol-gel methods, [27][28][29][30] all of which have demonstrated excellent corrosion protection and antioxidant properties for PCM cores. Nevertheless, the particle shells may be relatively fragile and unable to endure frequent melting-freezing cycles, potentially leading to issues like PCM leakage and microstructure failure.…”

Section: Introductionmentioning

confidence: 99%

A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Wang,

Tao,

et al. 2024

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Addressing critical issues such as high‐temperature corrosion, leakage, degradation, and subpar cyclic performance is imperative for phase change materials (PCMs), prompting the development of appropriate encapsulation techniques to surmount these challenges. In this study, a dual encapsulation strategy is proposed for high‐temperature micro PCM particles. Al–Si core is microencapsulated via the “solvent evaporation‐heating curing” method. Subsequently, TiO2 is employed as the skeleton material for form‐stable encapsulation of PCM microcapsules by “cold pressed sintering”. Detailed analysis of the crystalline phase transformation mechanism in the sintering synthesis pathway of TiO2 underscore its potential as a robust structural material with exceptional thermal stability. Furthermore, the incorporation of hexagonal boron nitride (hBN) results in a substantial enhancement of the thermal conductivity of the composites, increasing by 121.1–131.3%. The prepared form‐stable phase change microcapsules (FSPCMs) are subjected to 5000 thermal cycles in the air atmosphere. There is no observed PCM leakage or composite ruptures in the FSPCM. Moreover, the oxidized mass gain is merely 3.3%, signifying exceptional oxidation resistance. Thermophysical analysis indicates that FSPCM can retain 91.3% of the enthalpy after 2000 cycles, with over 80% preservation after 5000 cycles, underscoring its remarkable cyclic thermal durability.

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Section: Introductionmentioning

confidence: 99%

A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Wang,

Tao,

et al. 2024

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“…[4] In this range, PCMs that can be considered include nitrate-based molten salts, [5][6][7] sugar alcohols, [8][9][10][11][12][13][14] and lowmelting-point metals/alloys. [15,16] Among them, metals/alloys are promising candidates because of their intrinsic advantages including high thermal conductivity and large heat storage density. Very fast heat transfer can be achieved due to the high thermal conductivity of metallic heat storage media, thereby increasing the energy storage efficiency of the system when using metallic PCMs.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Microencapsulated Low‐Melting‐Point Sn–Bi Alloy for Latent Heat Storage

Chen

Liu

et al. 2022

Energy Tech

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Low‐melting‐point SnBi alloy is a good phase change material (PCM) with high thermal conductivity and good stability for heat storage over 100 °C, which can be used for waste heat recovery and solar thermal storage. To solve the critical leakage problem and increase the heat transfer area of PCM, the fabrication of microcapsules of SnBi that are encapsulated by the stable SnO2 oxide shell is reported. The microcapsules are prepared by a two‐step method, in which the SnBi alloy microspheres are first treated by hot water or vapor and second heat treated under an oxygen atmosphere. The SnBi@SnO2 microcapsules are well sealed, and can endure a melting–solidification thermal cycle over 100 cycles with good stability. The microcapsules have a melting point of around 139 °C and an enthalpy of around 43 J g−1, similar to the theoretical values of SnBi. The simple preparation method and good thermal properties of the microcapsules ensures their application in heat storage and thermal management.

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Thermal Expansion Challenges and Solution Strategies for Phase Change Material Encapsulation: A Comprehensive Review

Xu,

Shi,

et al. 2024

Adv Funct Materials

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Phase change materials (PCMs) have attracted increasing attention due to their efficient heat storage capability and small temperature fluctuation. And encapsulation has been recognized as an effective method to solve issues such as corrosion and leakage. For a long time, restricted by thermal expansion, encapsulation of PCMs has remained in the low‐temperature field and liquid‐state coating. In recent years, with the expansion of PCMs encapsulation into the medium and high temperature field and the development of solid‐state coating technology, encapsulation methods that consider thermal expansion have greatly improved the cycle life of encapsulated PCMs and make solid‐state coating of medium and high temperature PCMs possible. Herein, first, this paper summarizes the thermal expansion rates of common core and shell materials, as well as the thermal expansion behavior and stress analysis within confined spaces, proposing the necessity to solve thermal expansion issues. Subsequently, the solution strategies for solving thermal expansion issues in both macrocapsules and microcapsules are introduced. On this basis, the advantages and disadvantages of each strategy have been compared, and the applications of encapsulated PCMs after resolving thermal expansion issues have been introduced. Finally, the current issues, corresponding solutions, and future research directions have been put forward.

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Synthesis and characterization of a novel high durability alloy microcapsule for thermal energy storage

Cited by 28 publications

References 43 publications

A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Preparation of Microencapsulated Low‐Melting‐Point Sn–Bi Alloy for Latent Heat Storage

Thermal Expansion Challenges and Solution Strategies for Phase Change Material Encapsulation: A Comprehensive Review

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