Silicon interposers enable high-performance processors to integrate a significant amount of in-package memory, thereby providing huge bandwidth gains while reducing the costs of accessing memory. Once the price has been paid for the interposer, there are new opportunities to exploit it and provide other system benefits. We consider how the routing resources afforded by the interposer can be used to improve the network-on-chip's (NoC) capabilities and use the interposer to "disintegrate" a multi-core chip into smaller chips that individually and collectively cost less to manufacture than a large monolithic chip. However, distributing a system across many pieces of silicon causes the overall NoC to become fragmented, thereby decreasing performance as core-to-core communications between different chips must now be routed through the interposer. We study the performance-cost trade-offs of implementing an interposer-based, multi-chip, multi-core system and propose new interposer NoC organizations to mitigate the performance challenges while preserving the cost benefits.ii Acknowledgements First, I would like to express my sincerest gratitude to my supervisor, Natalie Enright Jerger, for her guidance and motivation during my time here. I have learned a lot from her expertise in computer architecture, on-chip networks, and research methodologies. I have been very lucky in having her as my mentor and she has been just wonderful to work with.I would also like to thank Gabriel Loh at AMD Corp., for his numerous inputs, suggestions and guidance throughout the work that I have been a part of during my programme. It has been a great opportunity and learning experience to have worked with him.