2017
DOI: 10.1039/c7ta03535g
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Synergistically toughening nacre-like graphene nanocomposites via gel-film transformation

Abstract: The gold standard of natural nacre provides the inspiration for assembling bioinspired nanocomposites.

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Cited by 44 publications
(24 citation statements)
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“…The interface in the nacre induces multiple toughening mechanism, such as mineral bridging, nanoasperities shearing, organic gluing, and tablet interlocking, [1] as shown in Figure 3. [122][123][124][125][126][127][128] In addition, different interface interactions could be reasonably combined to result in synergistic effect, [111,[129][130][131][132][133][134][135][136][137][138][139] which is similar to the multiple interface interactions in nacre. [48,75,[91][92][93][94] The interfacial crosslinking strategies contain hydrogen bonding, [95][96][97][98][99][100][101][102][103][104][105][106][107][108][109][110][111][112][113][114] ionic bonding, …”
Section: Interfacial Architecture Of Biological Materialsmentioning
confidence: 98%
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“…The interface in the nacre induces multiple toughening mechanism, such as mineral bridging, nanoasperities shearing, organic gluing, and tablet interlocking, [1] as shown in Figure 3. [122][123][124][125][126][127][128] In addition, different interface interactions could be reasonably combined to result in synergistic effect, [111,[129][130][131][132][133][134][135][136][137][138][139] which is similar to the multiple interface interactions in nacre. [48,75,[91][92][93][94] The interfacial crosslinking strategies contain hydrogen bonding, [95][96][97][98][99][100][101][102][103][104][105][106][107][108][109][110][111][112][113][114] ionic bonding, …”
Section: Interfacial Architecture Of Biological Materialsmentioning
confidence: 98%
“…Apart from alkaline-earth metal ions, the transition-metal ions, such as Cu 2+ , [138] Ni 2+ , [133] Zn 2+ , [116,166] and Mn 2+ , [136] etc., are also effective ionic bonders to strengthen the GANs. Recently, Wan et al [133] introduced Ni 2+ into adjacent GO nanosheets to obtain GO-Ni 2+ nanocomposites, which were then reduced into rGO-Ni 2+ nanocomposites.…”
Section: Ionic Bondingmentioning
confidence: 99%
“…Similarly, rGO sheets made at low temperature by modulating GO chemical structure have 1.9 times higher electrical conductivity than do SBG‐III sheets, but a lower strength (614 MPa) and toughness (14.9 MJ m −3 ). Moreover, as shown in Figure e, the tensile strength and toughness for the SBG‐III sheet are higher than for previously reported rGO sheets bridged through various bonding types, except for our very recently reported rGO sheets that are sequentially bridged by π–π bonding and covalent bonding agents . The detailed mechanical properties of these rGO sheets are tabulated in Table S10 (Supporting Information).…”
mentioning
confidence: 67%
“…On the other hand, interfacial cross‐linking can enable highly efficient load transfer between graphene interlayers, resulting in high mechanical properties . Moreover, various different interfacial interactions can be integrated into the graphene sheets, including hydrogen, ionic, π–π, and covalent bonding . However, the resulting graphene sheets generally show low electrical conductivities due to disruption of electron transport between graphene nanosheets by the cross‐linking agents .…”
mentioning
confidence: 99%
“…To date, various methods have been developed to integrate graphene sheets into 1D, 2D, and 3D macroscopic assemblies, including wet‐spinning, filtration, and hydrothermal treatment . Compared with graphene macroscopic assemblies prepared from graphene solution using conventional methods mentioned above, gel‐like graphene macroscopic assemblies have advantages in the construction of arbitrarily predesigned architectures in both microscopic and macroscopic scales without special reaction conditions . For example, in the case of preparation of graphene films from graphene solution, traditional methods including filtration, dip coating, and spin coating are time‐consuming and complicated while the preparation from gel‐like assemblies can be achieved by simply pressing.…”
mentioning
confidence: 99%