Abstract:In this study, WO 3 nanorods are directly blended with polyamic acid (PAA) solutions to improve the electrochromic capacity of WO 3 /PAA composite films. Specifically, the hexagonal WO 3 nanorods are prepared as inorganic reinforcements using a hydrothermal method and modified by 𝜸-aminopropyl triethoxysilane. After curing at 300 °C, the WO 3 nanorods/polyimide (PI) composite films demonstrate excellent mechanical and thermal properties. The tensile strength of the 1 wt% WO 3 /PI composite film is ≈110.27 MPa… Show more
“…Various strategies have been proposed to optimize NR dispersion and adjust the NR spatial distribution, and thus improve the mechanical properties of the corresponding PNCs. 10–14…”
Section: Introductionmentioning
confidence: 99%
“…Various strategies have been proposed to optimize NR dispersion and adjust the NR spatial distribution, and thus improve the mechanical properties of the corresponding PNCs. [10][11][12][13][14] Grafting small molecules onto the surface of NRs is the most widely used strategy to increase NR-polymer interaction, and thus regulate the dispersion of NRs in polymer matrices. [15][16][17] It is known that NRs can immobilize neighboring polymer chains and form bound rubber; well-dispersed NRs realized in higher NR-polymer interaction provide a greater exposed surface area, which can increase the content of bound rubber.…”
Controlling the spatial morphology of the nanorods (NRs) in polymer matrix and understanding the structure-property relationship are crucial for fabricating high-performance polymer nanocomposites (PNCs). By employing molecular dynamics simulations, we...
“…Various strategies have been proposed to optimize NR dispersion and adjust the NR spatial distribution, and thus improve the mechanical properties of the corresponding PNCs. 10–14…”
Section: Introductionmentioning
confidence: 99%
“…Various strategies have been proposed to optimize NR dispersion and adjust the NR spatial distribution, and thus improve the mechanical properties of the corresponding PNCs. [10][11][12][13][14] Grafting small molecules onto the surface of NRs is the most widely used strategy to increase NR-polymer interaction, and thus regulate the dispersion of NRs in polymer matrices. [15][16][17] It is known that NRs can immobilize neighboring polymer chains and form bound rubber; well-dispersed NRs realized in higher NR-polymer interaction provide a greater exposed surface area, which can increase the content of bound rubber.…”
Controlling the spatial morphology of the nanorods (NRs) in polymer matrix and understanding the structure-property relationship are crucial for fabricating high-performance polymer nanocomposites (PNCs). By employing molecular dynamics simulations, we...
“…1,2 Components generate a lot of heat while operation and if they are not dissipated quickly, the life of the electronic equipment will be greatly affected. [4][5][6][7][8] Polyimide is frequently utilized in thin films in contemporary communication applications due to its superior dielectric, mechanical and electrical insulating properties, but its inherent low thermal conductivity, typically below 0.2 W/mK, greatly limits its further applications. [9][10][11][12][13][14] Therefore, the manufacture of polyimide dielectric encapsulation materials with good thermal conductivity is important to effectively promote its use in the communications sector.…”
Section: Introductionmentioning
confidence: 99%
“…The requirement for heat dissipation in the B5G communication era is increasing due to the high packaging density 1,2 . Components generate a lot of heat while operation and if they are not dissipated quickly, the life of the electronic equipment will be greatly affected 4–8 . Polyimide is frequently utilized in thin films in contemporary communication applications due to its superior dielectric, mechanical and electrical insulating properties, but its inherent low thermal conductivity, typically below 0.2 W/mK, greatly limits its further applications 9–14 .…”
Polyimide (PI) is widely used in the communication field benefited from its low dielectric properties and good electrical insulating properties, however, its low thermal conductivity simultaneously limits its application in electronic packaging. Delayed heat dissipation can exacerbate the thermal stress generated by device operation to damage electronic structures, thereby affecting work efficiency. As a result, it is necessary to improve the thermal conductivity of polyimide and maintain excellent dielectric performance. Here, we demonstrate the polyimide (BPDA‐ODA) composites with ordered structure are prepared by filling commercial polyimides with aramid nanofibers connection nitrides greatly improve thermal conductivity and maintain the low dielectric loss. When the filling amount of SBN@CN is 30 wt%, the thermal conductivity increases to 1.162 W/mK, which is 8 times higher than that of pure PI (0.0147 W/mK). Moreover, thermal stability and mechanical properties are maintained, realizing that the dielectric constant is about 3.81 and the dielectric loss is as low as 0.0034 at 100 MHz, which endows a new insight for the application of polyimide in electronic packaging.
“…51 The WO 3 addition has no apparent effect on the chemical composition of PVA/starch/GO nanocomposite; this result is similar to previously reported literature. 52 The morphology of the filler particles and sample surfaces were investigated using SEM pictures to understand the distribution and dispersion of WO 3 particles inside the nanocomposites.…”
Polyvinyl alcohol (PVA)/starch/graphene oxide nanocomposites containing different ratios of tungsten oxide (WO3) were prepared for use in the medical field as low‐cost, facile, eco‐friendly, and biodegradable low‐energy γ‐ray shielding materials. The effect of different WO3 loading (0, 2, 4, 8, and 12 wt%) on nanocomposites' structural, mechanical, and gamma attenuation properties was studied. X‐ray diffraction, Fourier transform infrared spectroscopy, and scanning electron microscope verified the incorporation of WO3 into the nanocomposite matrix. The thermal stability and activation energy of the decomposition of nanocomposites showed continuous improvement with increasing WO3. The maximum tensile strength and elongation of nanocomposites were achieved by incorporating 4 wt% WO3 compared to the lowest tensile strength and elongation at 8 and 12 wt% of WO3, respectively. The good filler distribution inside the polymeric matrix at lower filler loading compared to the creation of voids and agglomeration at higher filler levels explains this behavior. It was found that nanocomposites' calculated mass attenuation coefficient μm (cm2/g) increased with increasing WO3 at different photon energies. Half‐value layer (HVL) and tenth‐value layer (TVL) values fall as WO3 concentration rises. The sample with 12 wt% of WO3 exhibits lower HVL and TVL values and higher μm, demonstrating a more remarkable gamma attenuation ability. Such results endorsed the prepared nanocomposites as low energy γ‐rays attenuation materials in medical fields.Highlights
PVA/starch/graphene oxide nanocomposites with different WO3s were fabricated as shielding materials.
The impact of WO3 on nanocomposites' mechanical and shielding characteristics was studied
Thermal stability of nanocomposites showed continuous improvement with increasing WO3
μm increased with continuously increasing WO3 at different photon energies.
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