2016
DOI: 10.1016/j.compscitech.2016.09.013
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Synergistic effect of BN and graphene nanosheets in 3D framework on the enhancement of thermal conductive properties of polymeric composites

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Cited by 155 publications
(52 citation statements)
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“…This is a relatively straightforward method but the compression moulding process itself is not commercially significant and therefore of limited interest. Another approach is to construct a freestanding filler framework as the heat transfer network, such as a graphene aerogel [39][40][41], BNNS aerogel [42,43] or complex aerogel [9,[44][45][46], and then encasing the network in a thermosetting matrix such as epoxy. Jiang et al [9] prepared a cellulose nanofiber supported boron nitride aerogel via sol-gel and freeze-drying, followed by casting with epoxy.…”
Section: Introductionmentioning
confidence: 99%
“…This is a relatively straightforward method but the compression moulding process itself is not commercially significant and therefore of limited interest. Another approach is to construct a freestanding filler framework as the heat transfer network, such as a graphene aerogel [39][40][41], BNNS aerogel [42,43] or complex aerogel [9,[44][45][46], and then encasing the network in a thermosetting matrix such as epoxy. Jiang et al [9] prepared a cellulose nanofiber supported boron nitride aerogel via sol-gel and freeze-drying, followed by casting with epoxy.…”
Section: Introductionmentioning
confidence: 99%
“…Shao et al. [ 90 ] investigated the synergistic influence of BNNSs and 3D graphene framework (GF)/BNNSs framework (BGF) on the improvement of thermal conductive characteristics in polyamide‐6 (PA6) composites. The thermal conductivity of PA6/BGF nanocomposite was enhanced up to 0.891 W m −1 K −1 which includes 6.8 and 1.6 wt% of graphene and BNNS respectively.…”
Section: Polymer Nanocomposites Based On Bnns Hybrid Fillersmentioning
confidence: 99%
“…The unique characteristics of h‐BN make it a favorable substrate in many potential applications including catalysts, sensors, electronic devices and dielectric substrates. [ 90–92 ] Introduction of h‐BN hybrid nanofillers in various polymer matrices also lead to applications in electronic devices, coating field and shielding purposes.…”
Section: Applicationsmentioning
confidence: 99%
“…However, most traditional epoxy thermosetting resin materials are amorphous polymers with low thermal conductivity (usually in the range of 0.17-0.21 W/ (mÁK)), which cannot meet the high-power thermal management requirements in a small space. [1,7,8] Adding fillers with high thermal conductivity is an effective way to improve the thermal conductivity of epoxy resin currently, including carbon nanotubes (CNT), graphite, [8][9]10,11] ceramic oxide (Al 2 O 3 , SiO 2 ) [12] and nitride (AlN, BN). [13][14]15,16] Among these materials, Hexagonal BN has been the preferred material used in thermal management applications because of low density, various forms, high mechanical strength, good thermal conductivity (320 W/ (mÁK)) and chemical stability, and inherent electrical insulation.…”
Section: Introductionmentioning
confidence: 99%