“…Many efforts have been devoted to improving the PCE of PSCs based on magnetron-sputtered NiO x (sp-NiO x ). ,− Despite all the advantages of magnetron sputtering, PCE of the sp-NiO x -based PSCs are still lagging behind those with solution-processed NiO x . , Low PCE likely originates from the prominent Ni 3+ issue in sp-NiO x , as Ni 3+ exhibits a double-edged sword effect in NiO x . On the one hand, a high concentration of Ni 3+ in the bulk provides holes and p-type properties for NiO x , which is necessary to achieve good charge transport in the bulk. , On the other hand, it is reported that excess Ni 3+ at the sp-NiO x surface may induce decomposition of the perovskite layer, leading to the loss of A-site cations and I – from the perovskite structure and leaving residual PbI 2 into the perovskite films. ,,, This produces all kinds of unwanted defects and chemical species at the interface, which causes carrier recombination and impedes charge transport. A higher Ni 3+ concentration can often be obtained with magnetron sputtering compared to with the solution method, , which promises better charge transport in the NiO x film.…”