Synergetic effect of benzotriazole and non-ionic surfactant on copper chemical mechanical polishing in KIO4-based slurries

Jiang, Liang; He, Yongyong; Niu, Xiangyu; Li, Yuzhuo; Luo, Jianbin

doi:10.1016/j.tsf.2014.01.086

Cited by 52 publications

(29 citation statements)

References 39 publications

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“…There is a threshold value of BTA ion concentration for the reaction to form an insoluble Cu-BTA film during the reaction of BTA and copper. It was observed that the copper removal rate gradually increased with higher BTA concentrations, when BTA addition was lower than 2 mM, a uniform and compact Cu-BTA passivating film could not be effectively built up [30]. Finsgar [31] considered BTA concentrations of 0.1-10 mM and found that rust-inhibition efficiency decreased with the addition of more than 10 mM BTA during co-electrospinning potential in 3% NaCl solution.…”

Section: Characterization Of Electro-chemical Corrosionmentioning

confidence: 99%

Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

et al. 2018

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The copper which an important component in the electronics industry, can suffer from discoloration and corrosion. The electrolytic copper foil was treated by 1,2,3-benzo-triazole (BTA) for an environmentally friendly non-chromate surface treatment. It was designed to prevent discoloration and improve corrosion resistance, consisted of BTA and inorganic sodium molybdate (Na2MoO4). Also the ratio of the constituent compounds and the deposition time were varied. Electrochemical corrosion of the Cu-BTA was evaluated using potentiodynamic polarization. Discoloration was analyzed after humidity and heat resistance conditioning. Surface characteristics were evaluated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Increasing corrosion potential and decreasing current density were observed with increasing Na2MoO4 content. A denser protective coating formed as the deposition time increased. Although chromate treatment under severe humidity (80% humidity, 80 °C, 100 h) provided the highest humidity resistance, surface treatment with Na2MoO4 had better heat discoloration inhibition under severe heat-resistant conditions (180 °C, 10 min). When BTA reacts with Cu to form the Cu-BTA-type insoluble protective film, Na2MoO4 accelerates the film formation without being itself adsorbed onto the film. Therefore, the addition of Na2MoO4 increased anticorrosive efficiency through direct/indirect action.

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Section: Characterization Of Electro-chemical Corrosionmentioning

confidence: 99%

Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

et al. 2018

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“…In the periodate-based slurry, the composition of the passivation film on copper surface is more complex [31]. Jiang et al [18] believed that the copper surface passivation film contains not only Cu(IO 3 ) 2 but also some Cu(IO 4 ) 2 .…”

Section: Raman Spectra Experimentsmentioning

confidence: 99%

“…10 indicate the obvious existence of I 2 , Cu 2 O, and CuH 4 I 2 O 10 Á6H 2 O on copper surfaces at pH 4 and pH 6. The formation of copper iodate and copper periodate is more likely to occur on the copper surface in acidic solutions [18,34]. Therefore, the patches of passivation film will contribute to the local galvanic corrosion, thus pitting will happen.…”

Section: Corrosion Behavior Of Copper In Periodate-based Solutionmentioning

confidence: 99%

“…These studies have mainly focused on the aspects like chemical and mechanical material removal, the surface quality, and the control of galvanic corrosion. Jiang et al [18] studied the synergetic effect of benzotriazole and the nonionic surfactant Pluronic Ò P103 on copper in KIO 4 -based slurries. It was found that the addition of Pluronic Ò P103 in benzotriazole could produce a complete passivation film to protect copper from mechanical excessive abrasion.…”

Section: Introductionmentioning

confidence: 99%

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Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry

et al. 2015

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Copper chemical mechanical polishing (CMP) in barrier layer slurries with periodate as oxidant has not been intensively studied. This work presents an investigation into copper tribocorrosion in potassium periodatebased slurries during CMP. The research focused on copper tribocorrosion behavior, the surface chemical and electrochemical reaction products, and the electrochemical mechanism during CMP. The copper surface film was characterized by Raman spectra experiments. Tribocorrosion tests combined with CMP chemical experiments were conducted to study the tribochemical behavior and wearaccelerated corrosion effect. The results show that copper corrosion is more severe in acid solutions than in alkaline conditions. The copper surface is mainly passivated with copper oxides, copper hydroxide, and copper iodide. Small amounts of copper iodate, copper periodate, and iodine could be detected under specific pH conditions. Abrasion could help to get a uniform passivation film on copper surface consisting of copper oxides, copper hydroxide, and copper iodide only. The material loss due to wear-accelerated corrosion during CMP was also investigated. The results show that under weakly alkaline conditions (pH 9 and pH 10), the wear-corrosion effect plays an important role in the total material loss due to corrosion. The wearaccelerated corrosion is mainly caused by the exposure of more cathodic reaction sites to the slurry for participation in the redox reaction and the local galvanic corrosion during the CMP process. The high wear corrosion proportion of the total corrosion (DI c /I cc ) could help to obtain a better surface quality and desirable material removal rate during CMP.

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“…Chemical mechanical planarization (CMP), a surface polishing/ finishing/planarization technology, is known for providing global planarization [8][9][10][11]. It is a surface smoothening process aided by chemical corrosion and mechanical grinding.…”

Section: Introductionmentioning

confidence: 99%

The optimization of chemical mechanical planarization process-parameters of c-plane gallium-nitride using Taguchi method and grey relational analysis

et al. 2016

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Synergetic effect of benzotriazole and non-ionic surfactant on copper chemical mechanical polishing in KIO4-based slurries

Cited by 52 publications

References 39 publications

Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry

The optimization of chemical mechanical planarization process-parameters of c-plane gallium-nitride using Taguchi method and grey relational analysis

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